Semiconductor Integrated Circuit Switching Block Signal Path Selection
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Solution Overview
Problem
Conventional semiconductor integrated circuits face signal delays and structural limitations when transitioning between single chip and multi-chip package structures, leading to increased costs and reduced productivity due to differing signal characteristics.
Innovation Solution
A semiconductor integrated circuit design incorporating a first interface block for intra-chip signal transmission, a second interface block for inter-chip signal transmission, and a switching block that dynamically selects signal paths based on chip structure signals to bypass or engage the second interface block, allowing seamless operation in both single chip and multi-chip configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If interface logics are added to support multi-chip package structure, then inter-chip signal transmission capability is improved, but signal delay increases
Solution Approach 1:
The interface block is segmented into first interface logics for intra-chip communication and second interface logics for inter-chip communication. This segmentation allows signals to be routed through appropriate paths, reducing unnecessary delays while maintaining multi-chip package support capability.
Solution Approach 2:
A switching block is introduced as an intermediary component that dynamically selects between different signal paths. The switching block mediates between the first and second interface logics, routing signals through the optimal path based on whether intra-chip or inter-chip communication is required, thereby minimizing signal delay while preserving adaptability.
2Reliability
If different structures are fabricated for single chip and multi-chip package structures, then structure optimization for each mode is achieved, but manufacturing cost increases and productivity decreases
Solution Approach 1:
A single integrated circuit structure is designed to perform both single-chip and multi-chip package functions through the switching block that can dynamically configure signal paths. The first interface logics handle intra-chip communication while the second interface logics handle inter-chip communication, allowing one structure to serve multiple purposes without requiring separate optimized designs for each package type.
Solution Approach 2:
The switching block provides dynamic reconfiguration capability, allowing the same physical structure to adapt its signal routing behavior based on the operating mode (single-chip or multi-chip). This dynamic switching enables a single fabricated structure to optimize performance for different package configurations without requiring separate manufacturing processes.
3Adaptability or versatility
If interface logics are configured for multi-chip package, then inter-chip communication capability is improved, but device complexity increases
Solution Approach 1:
The interface logics are divided into distinct first interface logics and second interface logics with clearly defined roles. The first interface logics are optimized for intra-chip communication while the second interface logics handle inter-chip communication. This segmentation reduces overall complexity by allowing each segment to be independently optimized and managed.
Solution Approach 2:
The switching block serves as an intermediary that simplifies the overall system architecture by providing a centralized control mechanism for signal routing. Rather than having complex distributed routing logic throughout the interface blocks, the switching block consolidates the decision-making function, reducing device complexity while maintaining inter-chip communication capability.
Data Source
AI summary
A semiconductor integrated circuit includes: a first interface block configured to transmit and receive signals within the same chip; a second interface block configured to transmit and receive signals to and from different semiconductor chips; and a switching block configured to select a signal path in which the signal transmission and reception of the first interface block is not performed through the second interface block, in response to a chip structure signal.