Semiconductor Device Terminal Integration for Heat Dissipation
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Solution Overview
Problem
Conventional semiconductor devices face challenges in heat dissipation, material selection, and manufacturing complexity, with existing methods often resulting in insufficient heat dissipation, increased component count, and reduced reliability due to rigid case materials and complex terminal fixation processes.
Innovation Solution
A semiconductor device design featuring a base body, insulating plate, conductor layer, semiconductor element, outer peripheral case body with recesses, and a resin layer, where the terminal component is inserted into recesses and connected directly to the conductor layer without the need for conductive wires or elastic deformation, allowing for flexible terminal placement and improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive material is used to connect the connection terminal and substrate, then electrical connection is achieved, but heat dissipation performance is insufficient
Solution Approach 1:
The connection terminal is merged with the case body into a single integrated component. The terminal forms an integral part of the case body structure, eliminating the need for separate conductive connection materials. This integration creates a direct thermal conduction path from the semiconductor element through the terminal to the case body, significantly improving heat dissipation performance while maintaining electrical connection functionality.
2Stability of the object's composition
If the connection terminal is strongly fixed to the case body, then mechanical stability is improved, but the number of components and manufacturing steps increases
Solution Approach 1:
The connection terminal and case body are merged into a single integrated component. The terminal is formed as an integral part of the case body through molding or other manufacturing processes, eliminating the need for separate fixation components such as adhesives, fixing covers, or additional fasteners. This integration maintains strong mechanical stability while reducing component count and simplifying manufacturing steps.
3Strength
If a highly rigid material is used for the case body, then structural strength is improved, but bending and cracking occur during terminal fixation
Solution Approach 1:
The terminal and case body are merged into a single integrated component manufactured as one piece. This eliminates the terminal fixation process entirely, preventing bending and cracking that would occur during press-fitting or other fixation operations. The case body can use highly rigid materials for structural strength without compromising reliability, as there are no separate terminal fixation steps that could cause damage.
4Stability of the object's composition
If the terminal is fixed by elastic deformation of the case body, then fixation is achieved, but material selection is limited and cost increases
Solution Approach 1:
The terminal and case body are merged into a single integrated component. This eliminates the need for elastic deformation fixation methods, allowing the use of highly rigid, cost-effective materials for the case body without being constrained by the need for elastic properties. The integration approach provides versatility in material selection while maintaining reliable terminal fixation.
5Stability of the object's composition
If the terminal is bent during fixation, then connection is achieved, but manufacturing steps increase and terminal integrity may be compromised
Solution Approach 1:
The terminal and case body are merged into a single integrated component manufactured in one process. This eliminates the need for terminal bending operations entirely, reducing manufacturing steps and preventing potential damage to the terminal from external forces applied during bending. The integrated structure ensures terminal integrity while achieving secure connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves effective heat dissipation, increased design flexibility, and reduced manufacturing costs by eliminating the need for conductive wires and elastic materials, while allowing for the use of rigid case materials without risk of breakage, thus enhancing the reliability and cost-effectiveness of the semiconductor device.
Implementation Method 1
a resin layer at least sealing the semiconductor element and the first connection terminal portion
Implementation Method 2
The conductor layer is formed on a surface of the insulating plate. The semiconductor element is connected to the conductor layer
Implementation Method 3
The outer peripheral case body has a plurality of recesses formed therein. The outer peripheral case body has inner peripheral side openings formed in its inner peripheral surface
Data Source
AI summary
In a semiconductor device, an outer peripheral case body has guiding portions formed therein as a plurality of recesses. The plurality of guiding portions each include an upper end opening. The outer peripheral case body has inner peripheral side openings formed in its inner peripheral surface, each of which is continuous with the upper end opening, extends from an upper end face toward a base body and is continuous with the guiding portion. The first insertion portion is inserted into a first guiding portion of the plurality of guiding portions. The first external terminal portion is continuous with the first insertion portion and extends through the upper end opening in the first guiding portion to outside of the outer peripheral case body. The first connection terminal portion is continuous with the first insertion portion and connected to a conductive pattern through the inner peripheral side opening.