Semiconductor Module Terminal Layout for Heat-Safe Laser Welding
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Solution Overview
Problem
Existing laser welding methods for connecting terminals in semiconductor modules can cause damage to insulating sheets due to excessive heat, leading to a deterioration in dielectric strength.
Innovation Solution
The semiconductor module design includes a laminated terminal portion with a first terminal having a first region, a second region, and a third region, where the third region is positioned away from the insulating sheet, allowing for laser welding of the connection member without direct heat transfer to the insulating sheet, thereby preventing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If laser welding is performed on the terminal and connection member with direct contact to the insulating sheet, then welding strength is improved, but the insulating sheet is damaged due to excessive heat
Solution Approach 1:
The terminal is divided into three distinct regions: a first region in contact with the insulating sheet, a second region for welding, and a third region extending away from the insulating sheet. This segmentation allows the welding operation to occur in the second region where heat can be dissipated without directly damaging the insulating sheet, while maintaining electrical connectivity through all three regions
Solution Approach 2:
The terminal structure extends in the thickness direction (z-direction) away from the insulating sheet surface, creating a three-dimensional configuration. The second region is positioned at a specific distance from the insulating sheet, allowing laser welding to be performed without the heat affecting the insulating sheet, thus resolving the contradiction between welding strength and heat damage prevention
2Object-affected harmful factors
If the third region of the terminal extends away from the insulating sheet, then heat damage to the insulating sheet is prevented, but the terminal structure becomes more complex
Solution Approach 1:
The three-region terminal structure serves multiple functions: the first region provides electrical contact with the insulating sheet, the second region serves as the welding zone, and the third region extends away to prevent heat damage. This multi-functional design integrates heat dissipation, electrical connectivity, and mechanical bonding into a single component, reducing the need for additional separate components and thus offsetting the structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration prevents damage to the insulating sheet, maintaining its insulating properties and preventing deterioration in dielectric strength.
Implementation Method 1
laser welding is known as a method for bonding a connection member and a terminal without causing physical stress thereto... a laser beam is emitted to the metal members to locally melt these metal members. By solidifying the melted these metal members, the metal members are bonded to each other
Implementation Method 2
the laser energy is locally concentrated to melt the metal members in the incident direction of the laser beam
Implementation Method 3
an ultrasonic bonding method has been proposed as a method for connecting a connection member and a terminal... ultrasonic vibration is generated on a bonding portion. This vibration electrically and mechanically connects the connection member and the terminal
Data Source
AI summary
A semiconductor module includes an insulating sheet which has a first surface and extends in a first direction and a first terminal. The first terminal has a first region disposed on the first surface of the insulating sheet and having a first width in a second direction perpendicular to the first direction, a second region extending from the first region and having a second width in the second direction narrower than the first width, and a third region located away from the first surface and being electrically connected to both the first region and the second region.