Semiconductor Module Terminal Layout for Stable Overlap Spacing
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Solution Overview
Problem
In semiconductor modules where first and second connection terminals overlap, it is difficult to maintain a consistent distance between them during the resin molding process, leading to variations in spacing that can affect insulation and inductance.
Innovation Solution
The semiconductor module design includes a first connection terminal with an internal terminal and external terminal, and a tie bar remaining portion that extends from the internal terminal, allowing it to be held by the mold parts during resin molding, thereby maintaining a consistent distance with the second connection terminal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the first and second connection terminals are arranged to overlap each other to reduce wiring inductance, then the wiring inductance is reduced, but it becomes difficult to maintain a consistent distance between them during the resin molding process
Solution Approach 1:
The patent introduces a mold support portion as an intermediary element that engages with the first connection terminal during resin molding. This support portion acts as a mediator that holds the first connection terminal at a predetermined position, thereby maintaining a consistent distance with the second connection terminal. The mold support portion includes a support surface that contacts the first connection terminal and extends in the width direction, providing stable positioning without affecting the overlapping arrangement that reduces inductance.
2Manufacturing precision
If the first connection terminal is held by the mold parts during resin molding to maintain consistent distance, then the distance consistency is improved, but the mold structure becomes more complex
Solution Approach 1:
The mold support portion is designed to serve multiple functions: it acts as both a structural support element and a positioning mechanism. The support portion engages with the first connection terminal while being integrated into the mold structure, allowing the mold to perform both the molding function and the positioning function simultaneously. This multi-functionality reduces the need for additional complex positioning mechanisms.
Solution Approach 2:
The mold support portion is strategically positioned only where needed - specifically where the first connection terminal requires positioning. The support portion extends in the width direction but is localized to the critical positioning area, providing precision only where necessary while keeping the rest of the mold structure simple and easy to manufacture.
3Ease of manufacture
If the tie bar remaining portion extends from the internal terminal in a direction intersecting the first and second directions, then the manufacturing process is simplified, but the structural complexity of the terminal increases
Solution Approach 1:
The tie bar remaining portion is designed to extend in advance from the internal terminal in a predetermined direction that intersects with both the first direction (length direction of second connection terminal) and second direction (width direction). This preliminary extension is performed during the terminal fabrication process itself, allowing the terminal to be pre-positioned and pre-oriented before the resin molding process, thereby simplifying the overall manufacturing process while the terminal structure remains integrated and compact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design stabilizes the distance between the connection terminals, reducing variations in insulation properties and inductance, while simplifying the manufacturing process by integrating the control and internal terminals with the tie bar remaining portion.
Implementation Method 1
a molten resin is injected into the cavity. When the molten resin is solidified, the resin molded part that integrally seals the semiconductor element and the first and second connection terminals is produced.
Data Source
AI summary
In a semiconductor module, first and second connection terminals and a control terminal are electrically connected to a semiconductor chip. The second connection terminal extends in a first direction in a resin molded part and projects from a predetermined surface of the resin molded part. An internal terminal of the first connection terminal extends in the resin molded part along the first direction and overlaps with the second connection terminal with a predetermined space therebetween in a second direction, and is exposed from an opening portion of the resin molded part. An external terminal of the first connection terminal is connected to the internal terminal at the opening portion and projects outside the resin molded part. The first connection terminal includes a tie bar remaining portion extending from the internal terminal in a direction that intersects the first direction and the second direction.