Semiconductor Module Terminal Resin Structure for Insulation Stability
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Solution Overview
Problem
Conventional semiconductor modules face issues with terminal deformation leading to insufficient insulation distance between the cooling portion and the terminal, which can cause failure and hinder miniaturization.
Innovation Solution
Incorporating a lower side resin that covers part of the terminal's lower surface to secure insulation distance and prevent deformation, integrated with the sealing resin through transfer molding to enhance stability and reduce manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the terminal is made longer to extend from the side surface of the sealing resin, then the electrical connection function is improved, but the terminal deforms and the insulation distance between the cooling portion and terminal becomes insufficient
Solution Approach 1:
A support structure is introduced as an intermediary element between the terminal and the sealing resin. This support structure provides mechanical reinforcement to the terminal, preventing deformation while maintaining the required insulation distance from the cooling portion. The support structure acts as a mediator that allows the terminal to extend sufficiently for electrical connection without compromising insulation reliability.
Solution Approach 2:
The support structure is designed in advance to compensate for potential terminal deformation. By providing preemptive mechanical support, the structure prevents the terminal from bending or deforming during operation, thereby maintaining the insulation distance before any deformation can occur.
2Reliability
If the terminal extends further to improve electrical connection, then the connection reliability is improved, but the module size increases
Solution Approach 1:
The support structure is strategically positioned only where needed - specifically where the terminal requires mechanical reinforcement - rather than uniformly throughout the entire module. This localized approach provides the necessary structural support to maintain terminal reliability while minimizing the overall volume increase of the module.
Solution Approach 2:
The support structure utilizes the vertical dimension (height direction) to provide reinforcement without significantly increasing the horizontal footprint of the module. By extending the support structure upward from the sealing resin surface, the design maintains compact horizontal dimensions while achieving the required electrical connection reliability.
3Reliability
If a support structure is added to prevent terminal deformation, then the insulation distance is maintained, but the device complexity increases
Solution Approach 1:
The support structure is integrated with the existing sealing resin and terminal components rather than being a completely separate element. The support structure merges with the sealing resin body and works in conjunction with the terminal, creating a unified assembly that maintains insulation distance without requiring additional complex subsystems.
Solution Approach 2:
The support structure serves multiple functions simultaneously: it provides mechanical reinforcement to prevent terminal deformation, maintains the insulation distance from the cooling portion, and integrates with the sealing resin structure. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity.
Data Source
AI summary
Provided is a semiconductor module, including: a semiconductor chip; a terminal, configured to extend in a extending direction, and be connected electrically with the semiconductor chip; a sealing resin, configured to seal the semiconductor chip, and cover at least a part of an upper surface of the terminal and at least a part of a lower surface of the terminal; and a lower side resin, configured to extend in the extending direction from the sealing resin, and cover at least a part of the lower surface of the terminal, wherein in the extending direction, a length at which the sealing resin and the lower side resin cover the lower surface of the terminal is greater than a length at which the sealing resin covers the upper surface of the terminal in the extending direction; and wherein the sealing resin and the lower side resin are formed of a same material.