Semiconductor Terminal Configuration for Size Reduction
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Solution Overview
Problem
Existing semiconductor devices face challenges in reducing size along the terminal arrangement direction while maintaining the electric conducting capability and structural integrity, particularly due to limitations in reducing the size of resin-made terminal boards without compromising strength, withstand voltage, and processing accuracy.
Innovation Solution
The semiconductor device incorporates terminals with a first portion and a second portion, where the first portion is positioned inside the resin portion and the second portion is outside, with the first portion being longer in the Z-direction and shorter in the X-direction than the second portion, allowing for reduced body size while maintaining the creeping distance and conducting capability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the width of recessed portions and partition walls in resin-made terminal boards is reduced to decrease device size, then the device size along terminal arrangement direction is reduced, but the strength, withstand voltage, and processing accuracy of the resin-made terminal board deteriorate
Solution Approach 1:
The terminal board is divided into multiple independent terminal regions separated by recessed portions. Each terminal region can be independently designed and optimized, allowing the recessed portions to be strategically positioned to provide structural support while minimizing their width to reduce overall device size.
Solution Approach 2:
The partition walls and recessed portions are integrated into the terminal board structure in a nested manner, where the partition walls extend from the board surface and the recessed portions are formed within the board thickness. This nested structure provides both electrical isolation and mechanical strength without requiring additional external components.
2Volume of moving object
If the width of recessed portions and partition walls in resin-made terminal boards is reduced to decrease device size, then the device size along terminal arrangement direction is reduced, but the withstand voltage between adjacent terminals deteriorates
Solution Approach 1:
The recessed portions are strategically positioned at critical locations where electrical isolation is most needed, such as between adjacent terminals with different potentials. The partition walls are designed with optimized thickness and height at specific locations to provide sufficient creepage distance and withstand voltage while minimizing material usage and device size.
Solution Approach 2:
Instead of relying solely on increasing the width of recessed portions and partition walls in the planar direction to improve withstand voltage, the invention utilizes the thickness dimension of the terminal board. The partition walls extend vertically from the board surface, and the recessed portions are formed with controlled depth, creating a three-dimensional electrical isolation structure that provides adequate creepage distance without increasing the device footprint.
3Volume of moving object
If the width of recessed portions and partition walls in resin-made terminal boards is reduced to decrease device size, then the device size along terminal arrangement direction is reduced, but the processing accuracy requirements for the resin-made terminal board increase
Solution Approach 1:
The invention optimizes the dimensional parameters of the recessed portions and partition walls to achieve a balance between device size reduction and manufacturing feasibility. The width, height, and depth of these features are carefully selected to be within the capabilities of standard molding and machining processes, ensuring that high precision is not compromised while still achieving compact device dimensions.
Data Source
AI summary
A semiconductor device includes a semiconductor chip, multiple terminals arranged in a first direction, a resin portion sealing the semiconductor chip and the terminals. The terminals are projected from a side surface of the resin portion in a second direction, and include at least one subject terminal having a first portion and a second portion. In the subject terminal, a first longitudinal end of the first portion is positioned inside of the resin portion and a second longitudinal end of the first portion is positioned outside of the resin portion, and the second portion is arranged adjacent to the first portion. Further, a length of the first portion is greater than a length of the second portion in the third direction, and a length of the first portion is smaller than a length of the second portion in the first direction.