Semiconductor Terminal Structure Without Solder Voids
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Solution Overview
Problem
Void formation in the solder connection between the interconnect and terminal reduces the connection reliability of semiconductor devices.
Innovation Solution
A semiconductor device design that includes a laminate with a semiconductor element, an insulating substrate, and interconnects connected through through holes, using elastic terminals with bulges that engage with depressions in the interconnects, and a fixing member to electrically isolate and mechanically fix these terminals, eliminating the need for solder.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder is used to connect the interconnect and terminal, then electrical connection is achieved, but void formation reduces connection reliability
Solution Approach 1:
The patent extracts and eliminates the solder material from the connection system, replacing it with a direct mechanical and electrical connection between the interconnect and terminal through the elastic terminal structure, thereby removing the source of void formation
Solution Approach 2:
The patent replaces the thermal-mechanical soldering process with a purely mechanical elastic contact system, where the elastic terminal deforms to create reliable electrical connection without requiring solder material that can form voids
2Reliability
If solder is used for connection, then electrical connectivity is established, but inductance increases
Solution Approach 1:
The patent removes the solder layer from the connection path, eliminating the additional inductance introduced by solder joints and replacing it with a direct metal-to-metal elastic contact that has lower inductance
Solution Approach 2:
The patent changes the connection method from a rigid solder joint to an elastic mechanical contact, altering the electrical parameters by reducing inductance while maintaining connection reliability through elastic deformation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves good connection reliability and mechanical stability without solder, reducing inductance and void formation, while maintaining high positional accuracy and connection reliability.
Implementation Method 1
first and second elastic terminals holding the laminate therebetween. The first terminal includes a bulge that engages with a depression in the interconnect
Data Source
AI summary
A semiconductor device includes a laminate including a semiconductor element, an insulating substrate on a first surface of the semiconductor element, an interconnect on the insulating substrate, and an interconnect member on a second surface of the semiconductor element. The interconnect is electrically connected to a first electrode in the first surface of the semiconductor element through a through hole in the insulating substrate. The interconnect member is electrically connected to a second electrode in the second surface of the semiconductor element. The semiconductor device further includes first and second elastic terminals holding the laminate therebetween. The first terminal includes a bulge that engages with a depression in the interconnect. The second terminal contacts the interconnect member. The semiconductor device further includes a fixing member fixing the first terminal and the second terminal while electrically isolating the first terminal and the second terminal from each other.