Semiconductor Test Jig with Movable Ground Block for Stable Contact
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Solution Overview
Problem
Conventional test jigs for semiconductor products face issues with poor contact due to dimensional variations and deformation of leads, leading to unstable electrical characteristic measurements.
Innovation Solution
A test jig design featuring movable lead pressers and substrate electrodes, with a conductive ground lock and dielectric materials, allows for precise contact without excessive force, mitigating damage and ensuring stable electrical characteristic measurements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If strong pressing force is applied by lead pressers to establish good contact, then contact reliability is improved, but lead deformation such as bending occurs
Solution Approach 1:
The test jig employs a movable ground block that can be positioned at different locations to adapt to dimensional variations in leads. This dynamic adjustment capability allows the system to maintain reliable contact without applying excessive pressing force that would cause lead deformation. The movability of the ground block provides flexibility in accommodating lead position variations while keeping pressing force within safe limits.
2Shape
If weak pressing force is applied by lead pressers, then lead deformation is avoided, but poor contact occurs due to dimensional variation
Solution Approach 1:
The movable ground block can be repositioned to compensate for dimensional variations in lead positions. This dynamic positioning capability ensures that the pressing force remains effective for establishing reliable contact without needing to increase the magnitude of pressing force, thereby avoiding lead deformation while maintaining good contact reliability.
Solution Approach 2:
The movable ground block acts as an intermediary element between the lead pressers and the substrate electrodes. By allowing the ground block to move and adapt to lead position variations, it mediates the contact process to achieve reliable electrical connection without requiring excessive pressing force that would deform the leads.
3Ease of manufacture
If conventional test jig structure is used with fixed electrodes, then manufacturing simplicity is maintained, but measurement stability deteriorates due to poor contact
Solution Approach 1:
The test jig incorporates a movable ground block that can be repositioned to adapt to dimensional variations in semiconductor products. This dynamic feature, while adding some complexity to the structure, significantly improves measurement stability by ensuring consistent and reliable contact between leads and substrate electrodes across different products and production batches.
Solution Approach 2:
The invention changes the positional parameter of the ground block to adapt to variations in lead dimensions. By making the ground block movable rather than fixed, the system can adjust its position to maintain optimal contact conditions, thereby improving measurement stability without requiring complete redesign of the entire test jig structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The test jig effectively reduces lead damage and ensures stable electrical characteristic measurements by maintaining contact without deforming the leads, even with dimensional variations, and enhances heat dissipation.
Implementation Method 1
it is difficult to reduce ground inductance as small as possible and to suppress characteristic degradation due to self-generated heat of the semiconductor product because the heat is hard to sufficiently dissipate to the test jig
Implementation Method 2
lead pressers disposed so as to be movable to positions opposite to the first substrate electrode and the second substrate electrode on the substrate and configured to press the leads against the first substrate electrode and the second substrate electrode
Data Source
AI summary
A test jig for testing electrical characteristics of a semiconductor product includes a conductive ground block for supporting the semiconductor product thereon; a substrate provided on the ground block, and having a first and a second substrate electrodes formed on the substrate for the respective electrodes to be in contact with leads of the semiconductor; and lead pressers for pressing the leads against the first and the second substrate electrodes, respectively, so that electrical connection is established between the respective leads and the first and the second substrate electrodes in testing the semiconductor product.