Semiconductor Test Socket for Simultaneous Top and Bottom Terminal Evaluation
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Solution Overview
Problem
Current methods for testing electrical characteristics of semiconductor device packages are time-consuming and can lead to the unnecessary discarding of non-defective upper semiconductor device packages based on the test results of the lower package.
Innovation Solution
A test apparatus and method that includes a socket with first and second connection units to simultaneously test the electrical connection states of both the bottom and top surface connection terminals of a semiconductor device package, using a test board and handler to apply and receive signals, ensuring efficient and rapid testing without discarding non-defective packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If sequential testing of bottom and top surface connection terminals is performed, then testing can be completed with simple test apparatus, but testing time is excessive and non-defective upper packages may be discarded
Solution Approach 1:
The test apparatus is segmented into separate first and second connection units, where the first connection unit tests bottom surface connection terminals and the second connection unit tests top surface connection terminals. This segmentation allows simultaneous independent testing of both surfaces, reducing total testing time while maintaining manageable complexity through modular design
Solution Approach 2:
The testing approach transitions from sequential single-surface testing to simultaneous multi-surface testing by adding a second connection unit that operates in parallel. This dimensional expansion of the testing capability allows both bottom and top surfaces to be tested concurrently, eliminating the time loss associated with sequential testing
2Reliability
If testing is performed on bottom surface connection terminals first, then the testing process is simple, but non-defective top surface terminals may be discarded based on faulty bottom surface results
Solution Approach 1:
The test apparatus merges the functionality of testing both bottom and top surface connection terminals into a single integrated system. By combining the first connection unit (for bottom surface) and second connection unit (for top surface) into one apparatus that operates simultaneously, the system ensures that both surfaces are evaluated together, preventing premature discarding of potentially good packages based on single-surface results
Solution Approach 2:
The system implements feedback by testing both bottom and top surface connection terminals simultaneously and using the combined results to make final package acceptance decisions. This feedback mechanism ensures that a package is not discarded unless both testing paths indicate failure, thereby improving evaluation accuracy and maintaining higher package yield
3Productivity
If separate testing of bottom and top surface connection terminals is performed sequentially, then each surface can be tested independently, but overall testing efficiency is reduced
Solution Approach 1:
The socket is designed with universal multi-functionality, incorporating both the first connection unit for bottom surface testing and the second connection unit for top surface testing within a single integrated structure. This multi-functional design enables simultaneous testing of both surfaces, dramatically improving testing efficiency while the modular socket architecture keeps the structural complexity manageable
Data Source
AI summary
An apparatus for testing electric characteristics of a test object including first connection terminals on a bottom surface and second connection terminals on a top surface, the apparatus comprises a test board comprising first pads on a predetermined surface; a socket configured to electrically connect the test object to the test board; and a handler configured to transport the test object to the socket. The socket comprises a first connection unit configured to be electrically connected to the first connection terminals of the test object and a second connection unit configured to be electrically connected to the second connection terminals of the test object.