Semiconductor Test Terminal Arrangement for Reliable Potential Supply
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Solution Overview
Problem
Existing electrical test methods for semiconductor devices face challenges in ensuring reliable potential supply to multiple terminals, particularly in high-voltage and low-voltage circuits, leading to issues with insulation withstand voltage tests due to potential gaps and foreign matter interference.
Innovation Solution
The method involves using a combination of test terminals that contact both the under surfaces and top surfaces of leads, with a test terminal arrangement that ensures consistent potential supply across all leads, including the use of a test terminal that presses against the top surfaces in one batch and another that contacts the under surfaces, to prevent spark occurrence and ensure reliable testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If contact pins are pressed against the under surfaces of the leads to supply potential, then the electrical test can be performed, but potential gaps may occur leading to unreliable potential supply
Solution Approach 1:
The test terminal arrangement is segmented into two distinct groups: contact pins that contact the under surfaces of the leads, and holding members that contact the top surfaces of the leads. This segmentation ensures that potential is supplied through multiple independent paths, eliminating potential gaps and improving potential supply reliability.
Solution Approach 2:
The invention transitions from a single-dimensional contact approach (only under surface contact) to a two-dimensional contact approach by adding top surface contact through holding members. This dimensional expansion creates redundant potential supply paths, ensuring reliable potential distribution across all leads.
2Reliability
If test terminals contact the under surfaces of the leads, then potential can be supplied, but foreign matter interference may occur causing test failures
Solution Approach 1:
The holding members act as intermediary contact points on the top surfaces of the leads, providing an alternative contact interface that is less susceptible to foreign matter interference. This intermediary approach ensures that even if under surface contacts are compromised, potential supply continues through the top surface contacts.
Solution Approach 2:
The invention provides beforehand cushioning against foreign matter interference by establishing dual contact paths (under surface and top surface). This redundant structure cushions against potential test failures caused by foreign matter, ensuring test reliability even when one contact path is compromised.
3Reliability
If multiple test terminals are arranged to contact each lead individually, then potential supply can be ensured, but the test setup becomes complex
Solution Approach 1:
The holding members serve multiple functions: they contact the top surfaces of the leads to supply potential, and simultaneously provide structural support for the test terminal arrangement. This multi-functionality reduces the need for additional specialized components, simplifying the overall test setup while maintaining reliable potential supply.
Solution Approach 2:
The invention merges the potential supply function and the structural support function into a single integrated test terminal arrangement. By combining contact pins and holding members into one cohesive structure, the design achieves reliable potential supply without proportionally increasing device complexity.
Data Source
AI summary
This invention enhances reliability of an electrical test. A semiconductor device manufacturing method in which a potential (first potential) is supplied by bringing a plurality of first and second test terminals into contact with a plurality of leads, respectively in the step of supplying the potential to the leads (first leads) to carry out the electrical test. The first test terminals come into contact with the leads, individually, and the second test terminals come into contact with the leads in one batch.