Semiconductor Testing Apparatus Temperature Compensation
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Solution Overview
Problem
Conventional methods for testing semiconductor circuits based on static power-supply current are challenged by increasing leak currents due to refinement and increased CMOS counts, which fluctuate with temperature changes, leading to incorrect defect judgments.
Innovation Solution
A testing apparatus and method that include a power supply, pattern generating section, power-supply current measuring section, and judging section, which uses temperature sensors and expected value storage to correct and compare measured static power-supply current, eliminating the influence of sub-threshold leak current fluctuations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If device refinement and CMOS count increase are implemented to improve functionality, then device capability is improved, but leak current increases and becomes difficult to stabilize
Solution Approach 1:
The patent applies parameter changes by measuring power supply current at multiple different temperatures and using these temperature-dependent measurements to calculate defect probabilities. This transforms the temperature-varying leak current from a problematic parameter into a useful parameter for defect detection, resolving the contradiction between device capability and leak current stability.
2Ease of operation
If conventional power-supply current testing is performed without temperature compensation, then testing simplicity is maintained, but measurement precision deteriorates due to temperature-induced leak current fluctuations
Solution Approach 1:
The patent implements feedback by measuring the actual power supply current at the device's operating temperature and using this measurement to calculate a temperature-compensated defect probability. This feedback mechanism allows the testing system to automatically adjust for temperature effects, improving measurement precision while maintaining ease of operation through automated compensation.
Solution Approach 2:
The patent applies preliminary action by pre-calculating expected power supply current values at multiple temperatures for defect-free devices and storing them as reference data. During testing, these pre-prepared reference values are used to compensate for temperature effects, eliminating the need for complex real-time temperature modeling and simplifying the testing process.
3Measurement precision
If temperature-compensated testing with multiple measurements is implemented to improve measurement precision, then defect judgment accuracy is improved, but testing complexity increases
Solution Approach 1:
The patent applies self-service by having the device under test serve as its own temperature sensor. The device's internal temperature characteristics are used to determine the measurement temperature, eliminating the need for separate temperature sensing hardware and reducing system complexity while maintaining high measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Accurately judges the defect-free status of semiconductor circuits by stabilizing leak current and accounting for temperature variations, reducing false defect identifications.
Implementation Method 1
a temperature sensor provided within the device-under-test
Data Source
AI summary
Here is provided a testing apparatus for judging whether or not a device-under-test is defect-free based on static power-supply current of the device-under-test, having a power supply for supplying power for driving the device-under-test to the device-under-test, a pattern generating section for supplying setting vectors for setting a circuit of the device-under-test into a predetermined state to the device-under-test, a power-supply current measuring section for measuring the static power-supply current supplied from the power supply to the device-under-test when the device-under-test is set into the predetermined state by the setting vectors and a judging section for obtaining temperature of the device-under-test from a temperature sensor provided within the device-under-test to judge whether or not the device-under-test is defect-free based on the static power-supply current measured by the power-supply current measuring section and the temperature of the device-under-test.