Semiconductor Testing Socket With Adjustable Support for BGA and LGA
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Solution Overview
Problem
Existing semiconductor testing sockets are inefficient due to the need for replacement when testing chips in different packaging types like BGA and LGA, as they are not adaptable to varying local structures.
Innovation Solution
A semiconductor testing socket with a height adjusting mechanism that allows for adjusting the supporting surface to accommodate different packaging types without replacing the socket, featuring a guiding frame with a central insertion opening and movable parts that can be operated to switch between positions for stable support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the same testing socket is used for different packaging types (BGA and LGA), then device complexity is reduced, but the testing accuracy deteriorates due to incompatible local structures
Solution Approach 1:
The patent implements a height adjusting mechanism that allows the supporting surface to dynamically change its position between a first position (for BGA packaging) and a second position (for LGA packaging). This dynamic adjustment enables the same testing socket to adapt to different packaging types while maintaining testing accuracy, resolving the contradiction between device complexity and manufacturing precision.
2Manufacturing precision
If testing sockets are replaced for different packaging types, then testing accuracy is improved, but productivity deteriorates due to frequent socket replacement
Solution Approach 1:
The patent designs a universal testing socket that can test both BGA and LGA packaged chips by adjusting the supporting surface height. The height adjusting mechanism allows the socket to accommodate different packaging types without replacement, improving productivity while maintaining testing accuracy through the multi-functional capability of the device.
3Device complexity
If the supporting surface is fixed, then device complexity is reduced, but adaptability deteriorates due to inability to accommodate different packaging heights
Solution Approach 1:
The patent transforms the fixed supporting surface into a dynamic, adjustable structure that can change height between a first position and a second position. This dynamic feature enables the socket to adapt to different packaging types (BGA and LGA) with different heights, improving adaptability while maintaining reasonable device complexity through the height adjusting mechanism.
Data Source
AI summary
The disclosed semiconductor testing socket comprises a testing socket body, a guiding frame, and a height adjusting mechanism. The guiding frame is mounted above the testing socket body and is provided with a central insertion opening. The height adjusting mechanism is embedded at the edges of the central insertion opening. The height adjusting mechanism comprises an operable part that can be operated and a movable part that can be moved between a first position located outside the central insertion opening and a second position located within the central insertion opening by operating the operable part. The movable part comprises a supporting surface configured for supporting a specimen to be tested when located at the second position.