Semiconductor Packaging Thinning with Support Wafer Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge lies in developing smaller semiconductor device packages that meet the demand for portable electronics while ensuring efficient electrical connectivity and radiation detection capabilities.
Innovation Solution
A method involving the formation of an electrically conductive layer on a semiconductor substrate, bonding a support wafer, thinning the substrate, forming electric contacts, and integrating circuitry with a controller system to detect radiation, which includes voltage comparators, counters, and a voltmeter to analyze electrical signals and determine radiation energy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the substrate of semiconductor is thinned to create compact packages, then the footprint and thickness are reduced, but the electrical connectivity and structural integrity may be compromised
Solution Approach 1:
A support wafer is bonded to the semiconductor substrate before thinning operations. This preliminary support structure allows the substrate to be thinned to the desired compact thickness while maintaining structural integrity and electrical connectivity throughout the thinning process and final operation.
Solution Approach 2:
The support wafer acts as an intermediary element between the thin semiconductor substrate and the packaging structure. It provides mechanical support and electrical pathways that enable the thinned substrate to maintain reliability despite its reduced thickness.
2Adaptability or versatility
If radiation detection capabilities are integrated into the semiconductor substrate, then portable electronics gain enhanced functionality, but the device complexity increases
Solution Approach 1:
The radiation detection functionality is merged directly into the semiconductor substrate by forming p-n junctions or p-i-n junctions within the substrate itself. This integration eliminates the need for separate detection components, thereby enhancing versatility while minimizing the increase in device complexity.
Solution Approach 2:
The semiconductor substrate serves multiple functions: it acts as both the structural base for the portable electronic device and the active radiation detection element. This multi-functionality enables enhanced capabilities without proportionally increasing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of compact semiconductor packages capable of efficient radiation detection and energy analysis, supporting the development of smaller portable electronics with enhanced performance.
Implementation Method 1
bonding, at the first electrically conductive layer, a support wafer to the substrate of semiconductor
Implementation Method 2
a first voltage comparator configured to compare a voltage of the contact pad to a first threshold; a second voltage comparator configured to compare the voltage to a second threshold
Implementation Method 3
a counter configured to register a number of particles of radiation absorbed by the substrate
Implementation Method 4
an integrator electrically connected to the contact pad, wherein the integrator is configured to collect charge carriers from the contact pad
Data Source
AI summary
Disclosed herein is a method comprising: forming a first electrically conductive layer on a first surface of a substrate of semiconductor, wherein the first electrically conductive layer is in electrical contact with the semiconductor; bonding, at the first electrically conductive layer, a support wafer to the substrate of semiconductor; thinning the substrate of semiconductor.