Semiconductor Device Through Holes Reduce Parasitic Capacitance

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Solution Overview

Problem

In semiconductor devices used in electronic apparatuses like digital cameras and video cameras, parasitic capacitance caused by a low-refractive-index film covering the peripheral circuit region reduces the electrical signal level and image quality.

Innovation Solution

The semiconductor device incorporates through holes in the low-refractive-index film above the amplifier circuits in the peripheral circuit region, reducing parasitic capacitance and improving image quality by using air as a dielectric substance and a transparent adhesive layer that forms a spherical surface to attenuate stray light.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If a low-refractive-index film is formed to cover the peripheral circuit region, then stray light is reduced and imaging performance is improved, but parasitic capacitance increases and electrical signal level decreases

Engineering Contradiction:
Improvestray light reductionVSAvoidelectrical signal level
Core Design Contradiction:
Illumination intensityVSReliability

Solution Approach 1:

The patent applies local quality by differentiating the treatment of different regions on the semiconductor substrate. The low-refractive-index film is selectively formed only on the imaging region containing photoreceptors and microlenses, while intentionally excluding the peripheral circuit region containing amplifier circuits. This localized application allows the film to reduce stray light in the imaging area without introducing parasitic capacitance in the circuit area, thus resolving the contradiction between optical performance and electrical signal integrity.

Inventive Principle:
Principle #3Local quality

2Illumination intensity

If the low-refractive-index film covers the amplifier circuit, then optical performance is improved, but parasitic resistance increases

Engineering Contradiction:
Improveoptical performanceVSAvoidparasitic resistance
Core Design Contradiction:
Illumination intensityVSReliability

Solution Approach 1:

The patent implements local quality by precisely controlling the deposition area of the low-refractive-index film. The film is applied exclusively to the imaging region where photoreceptors and microlenses are located, while the peripheral circuit region containing amplifier circuits remains uncovered. This spatial differentiation ensures that the optical benefits of the low-refractive-index film are realized without the electrical penalty of increased parasitic resistance in the amplifier circuits.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly reduces parasitic capacitance, suppresses the decrease in electronic signal levels, and enhances the quality of the final image information by minimizing stray light entry into photoreceptors.

Implementation Method 1

parasitic capacitance in an amplifier circuit, and therefore finally obtained image information is decreased in quality

Methodology Applied
Scientific EffectParasitic capacitance: Capacitance

Implementation Method 2

a transparent adhesive layer that forms a spherical surface to attenuate stray light

Methodology Applied
Scientific EffectStray light attenuation: Refraction

Data Source

PatentUS7884437B2Semiconductor device and electronic apparatus using the same
Publication Date: 2011.02.08 PANNOVA SEMIC LLC
  • US7884437B2 patent drawing
  • US7884437B2 patent drawing
  • US7884437B2 patent drawing

AI summary

A semiconductor device includes: a semiconductor substrate having an imaging region in which a plurality of photoreceptors are arranged, and a peripheral circuit region arranged around the imaging region; a plurality of microlenses formed on the imaging region; a low-refractive-index film formed on the semiconductor substrate to cover the plurality of microlenses and part of the peripheral circuit region; and a transparent substrate formed on part of the low-refractive-index film above the imaging region. A through hole is formed in part of the low-refractive-index film above an amplifier circuit arranged in the peripheral circuit region.