Semiconductor Circuit Patterning With Variable Mask Personalization
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Solution Overview
Problem
Current semiconductor manufacturing methods lack the ability to efficiently produce semiconductor integrated circuits with unique specific information storage capabilities, leading to challenges in confidentiality and communication security.
Innovation Solution
A method involving the use of a variable shaping exposure apparatus with a variable shaping mask to form specific circuits on semiconductor integrated circuits, differing from common circuits, allowing for unique information storage and secure communication capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a mask pattern fixed to a mask substrate is used to form common circuits, then manufacturing efficiency is improved, but the ability to produce unique specific information storage capabilities is lost
Solution Approach 1:
The patent divides the circuit formation process into two segments: common circuits formed by a fixed mask pattern for high efficiency, and specific information storage circuits formed by a variable shaping mask for uniqueness. This segmentation allows each part of the system to optimize for its specific function without compromising the other.
Solution Approach 2:
The patent introduces a variable shaping mask that can dynamically change its pattern configuration to form different specific information storage circuits on different semiconductor integrated circuits. This dynamic capability enables unique identification codes to be formed while maintaining the static fixed mask for common circuit formation.
2Adaptability or versatility
If a variable shaping exposure apparatus is used to form specific circuits with unique information, then adaptability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the fixed mask apparatus for common circuit formation with the variable shaping mask apparatus for specific circuit formation into a single integrated manufacturing process. This combination allows both functions to be performed in sequence on the same semiconductor substrate without requiring separate production lines.
Solution Approach 2:
The patent performs the formation of common circuits using the fixed mask pattern before forming the specific information storage circuits using the variable shaping mask. This preliminary action ensures that the foundation circuits are established first, and then the unique identification features are added, simplifying the overall process control.
3Reliability
If unique specific circuits are formed on each semiconductor integrated circuit, then communication confidentiality is improved, but production cost increases
Solution Approach 1:
The patent applies local quality by forming unique specific information storage circuits only in specific regions of the semiconductor substrate where identification codes are needed, while the common circuits are formed using a cost-effective fixed mask process. This localized approach ensures confidentiality where required without unnecessarily increasing costs across the entire device.
Solution Approach 2:
The patent uses the variable shaping mask to efficiently copy unique identification patterns onto multiple semiconductor integrated circuits in a systematic manner, reducing the manual or individual customization costs that would otherwise be associated with creating unique circuits on each chip.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the cost-effective production of semiconductor integrated circuits with enhanced security features, improving communication confidentiality and productivity by forming distinct specific circuits on each chip.
Implementation Method 1
a variable shaping mask configured to set a shape of a light and shade pattern which is radiated to the substrate
Data Source
AI summary
A method for manufacturing a semiconductor integrated circuit in each of a plurality of regions on a substrate, the method includes forming an electronic circuit as a part of the semiconductor integrated circuit in each of the plurality of regions by using a mask pattern fixed to a mask substrate, and forming a specific circuit, which expresses specific information specific to each of the semiconductor integrated circuits, on a part of each of the plurality of regions by using a variable shaping exposure apparatus having a variable shaping mask, the specific circuits formed on the plurality of regions being different from each other.