Semiconductor Assembly Thermal Dissipation via Conductive Vias
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Solution Overview
Problem
Conventional semiconductor power amplifier packages face inefficiencies due to high thermal resistance and parasitic losses, which affect power efficiency and require complex wiring and ground paths for RF signal delivery and heat dissipation.
Innovation Solution
A semiconductor device design featuring a package substrate with solder balls and vias that electrically and thermally connect a semiconductor die to a printed circuit board, providing a simplified ground path and enhanced thermal dissipation by transferring heat directly from the active side to the back side through conductive vias and solder prints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional semiconductor power amplifier packages use traditional wiring and ground paths, then electrical connectivity is achieved, but parasitic losses increase and thermal resistance is high
Solution Approach 1:
The package substrate is segmented into multiple ground planes separated by via holes, creating a distributed ground path structure. This segmentation reduces parasitic inductance by providing multiple parallel current return paths while maintaining electrical connectivity without requiring complex wiring interconnections.
Solution Approach 2:
The package substrate serves multiple functions simultaneously: it provides mechanical support, establishes electrical connectivity through integrated ground planes, and facilitates heat dissipation through its thermal conductive properties. This multi-functionality eliminates the need for separate dedicated ground path wiring, reducing parasitic losses and simplifying the overall device structure.
2Temperature
If conventional packages use traditional heat dissipation paths, then heat can be removed, but thermal resistance is high and efficiency decreases
Solution Approach 1:
The package substrate acts as an intermediary thermal conduction path between the semiconductor die and the external environment. Its high thermal conductivity mediates heat transfer from the heat-generating die, providing an efficient heat dissipation route that reduces thermal resistance and maintains power amplifier efficiency.
3Ease of manufacture
If chip to ground plane distance is increased, then manufacturing is easier, but parasitic losses increase due to RF signal degradation
Solution Approach 1:
Multiple ground planes are positioned in close proximity to the semiconductor die, creating equipotential regions that minimize voltage differences and reduce parasitic inductance. This configuration allows for shorter connection distances while maintaining ease of manufacture, as the ground paths are integrated into the substrate rather than requiring separate wiring.
4Reliability
If complex wiring is used to achieve ground paths, then electrical connectivity is improved, but device complexity and parasitic losses worsen
Solution Approach 1:
The ground path functionality is merged with the package substrate structure itself. Ground planes are integrated directly into the substrate layers with via holes providing vertical interconnections, eliminating the need for separate complex wiring assemblies. This merging maintains reliable electrical connectivity while significantly reducing device complexity and parasitic losses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design minimizes thermal resistance and parasitic losses, improving power amplifier efficiency and enabling effective heat dissipation while maintaining electrical conductivity for efficient RF signal delivery.
Implementation Method 1
a plurality of vias configured to couple the active side to the back side
Implementation Method 2
a plurality of solder prints coupled to the second set of contacts and the printed circuit board
Data Source
AI summary
A semiconductor device according to some examples of the disclosure may include a package substrate, a semiconductor die coupled to one side of the package substrate with a first set of contacts on an active side of the semiconductor die and coupled to a plurality of solder prints with a second set of contacts on a back side of the semiconductor die. The semiconductor die may include a plurality of vias connecting the first set of contacts to the second set of contacts and configured to allow heat to be transferred from the active side of the die to the plurality of solder prints for a shorter heat dissipation path.