Semiconductor Wafer Configuration via Selective Deposition

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Solution Overview

Problem

Conventional methods for configuring integrated circuit chips, such as using laser fuses, can introduce stress-induced cracking of wafers due to mechanical and thermal stresses, limiting the precision and reliability of device manufacturing.

Innovation Solution

A method involving a protective layer with varying configurations for each semiconductor device structure on a wafer, where a configuring substance is deposited through a dispenser to alter electrical properties, allowing for individualized configuration of circuit elements without the need for laser tools, thereby reducing stress on the wafer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If laser fuses are used to configure wafers, then device configuration precision is improved, but stress-induced cracking of the wafer occurs due to mechanical and thermal stresses

Engineering Contradiction:

Improvedevice configuration precisionVSAvoidstress-induced cracking

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the mechanical laser fuse system with a chemical deposition system. Instead of using laser tools that create mechanical and thermal stresses to melt or break fuses, the invention uses a dispenser to deposit configuring substances (such as metals, conductive polymers, or other materials) onto the wafer surface. This chemical/physical deposition process avoids the high-energy laser-induced stresses that cause cracking, while still achieving precise device configuration through controlled material placement.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the fundamental parameters of the configuration process by transitioning from high-energy laser processing to low-energy material deposition. The configuring substance is deposited at controlled rates and temperatures that do not induce thermal stress, and the mechanical contact is minimized through non-contact dispensing methods. This parameter change allows precise configuration without the harmful stress effects associated with laser fuses.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If conventional laser tools are used for configuration, then electrical characteristics can be fine-tuned, but the wafer is subjected to mechanical and thermal stresses

Engineering Contradiction:

Improveelectrical characteristics fine-tuningVSAvoidmechanical and thermal stresses

Core Design Contradiction:

ReliabilityVSStress or pressure

Solution Approach 1:

The patent substitutes the mechanical laser tool system with a material deposition system. The dispenser deposits configuring substances that alter electrical characteristics through controlled material placement rather than through laser-induced melting or ablation. This replacement eliminates the thermal and mechanical stresses inherent in laser processing while maintaining the ability to fine-tune electrical characteristics through selective material deposition on specific device regions.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces a configuring substance as an intermediary between the dispenser and the device structures. This substance acts as a mediator that modifies electrical characteristics without requiring direct laser interaction with the wafer. The configuring substance can be a conductive material, insulator, or other functional material that is deposited in controlled patterns to achieve the desired electrical fine-tuning, thereby avoiding direct laser-induced stress on the wafer substrate.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables precise and stress-reduced configuration of semiconductor devices, enhancing manufacturing precision and reducing the risk of damage associated with conventional laser fuse methods.

Implementation Method 1

a protective layer is provided on the structure layer... a dispenser is used to selectively deposit a configuring substance

Methodology Applied

Scientific EffectDeposition: Deposition (physical)

Implementation Method 2

a configuring substance is deposited in the opening that alters an electrical property of the circuit element

Methodology Applied

Scientific EffectChemical interaction: Chemical Bonding

Data Source

PatentUS10580753B2Method for manufacturing semiconductor devices

Publication Date: 2020.03.03 INFINEON TECHNOLOGIES AG

AI summary

According to an embodiment of a method of manufacturing a plurality of semiconductor devices on a wafer, the method includes forming a structure layer comprising a plurality of same semiconductor device structures and providing a protective layer on the structure layer. The protective layer on a first one of the plurality of semiconductor device structures differs from the protective layer on a second one of the plurality of semiconductor device structures.