Semiconductor Wiring High Young's Modulus Dicing Stress
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Solution Overview
Problem
The resolution of semiconductor devices is degraded due to increased pitch between photoelectric conversion devices, leading to reduced distance between pixels and end portions, which can result in destruction from heat and stress during dicing, causing wiring short-circuits and resolution deterioration.
Innovation Solution
Incorporating first and second wirings with higher Young's moduli, where second wirings with higher moduli are used at end portions to prevent deformation and short-circuits, and optimizing wiring configurations to reduce the distance between pixels and end portions while maintaining signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the pitch between photoelectric conversion devices is increased, then the distance between pixels and end portions is reduced, but the resolution is degraded and the devices become vulnerable to heat and stress during dicing
Solution Approach 1:
The patent changes the material parameter (Young's modulus) of the wirings to resolve the contradiction. By selecting wiring materials with higher Young's modulus values, the wirings gain sufficient mechanical strength to withstand heat and stress during dicing, enabling the end portions to be positioned closer to pixels without compromising device reliability or resolution
Solution Approach 2:
The patent applies local quality by differentiating wiring materials based on their position. Wirings at end portions, which are more susceptible to heat and stress during dicing, are made from materials with higher Young's modulus compared to other wirings. This localized material optimization provides enhanced mechanical strength where needed while maintaining overall device performance
2Productivity
If the pitch between photoelectric conversion devices is increased, then device arrangement is improved, but resolution is degraded
Solution Approach 1:
The patent changes the material parameter (Young's modulus) of wirings to enable tighter pitch between photoelectric conversion devices. By using high Young's modulus materials, the wirings can support smaller spacing without compromising mechanical integrity during dicing, thereby improving resolution while maintaining device arrangement efficiency
3Ease of manufacture
If wiring materials with low Young's modulus are used, then ease of manufacture is improved, but wiring deformation and short-circuits occur during dicing
Solution Approach 1:
The patent applies local quality by using different wiring materials for different positions. End portion wirings use materials with higher Young's modulus to prevent deformation and short-circuits during dicing, while other wirings may use materials optimized for ease of manufacture. This localized material differentiation ensures wiring integrity where needed without unnecessarily complicating the overall manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the likelihood of wiring short-circuits and destruction during dicing, maintains resolution by minimizing pitch between photoelectric conversion devices, and enhances operational stability by using materials with high Young's moduli and melting points.
Implementation Method 1
Wirings (222p to 229p) extending along the end portions in the one direction have Young's moduli higher than those of the other wirings
Data Source
Figure 1
Figure 2
Figure 3A~3B
AI summary
In a semiconductor device including unit cells which are aligned in one direction, wirings (222p to 229p, 223p', 224p', 226p' to 228p') disposed along end portions in the one direction have high Young's moduli.