Semiconductor Device Multilayer Wiring Noise Shielding
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Solution Overview
Problem
Existing semiconductor devices with redistribution layers face limitations in flexibility due to restrictions imposed by the layout of multilayer wirings, which affects the placement of metal parts and increases the risk of electric field noise affecting capacitors and signal lines.
Innovation Solution
The semiconductor device incorporates a multilayer wiring layer with signal lines and ground lines that are designed to accommodate assumed routes and locations of redistribution lines and new pads, allowing for flexible layout and effective shielding of electric field noise through strategically placed ground lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If metal parts are formed along the layout of external terminals and redistribution lines, then electric field noise shielding is improved, but layout flexibility deteriorates due to restrictions imposed by multilayer wiring layout
Solution Approach 1:
The patent applies preliminary action by forming ground lines in advance within the multilayer wiring structure, before the redistribution layer is created. These pre-positioned ground lines serve as predetermined shielding paths that can accommodate future redistribution line layouts without constraining design flexibility. The ground lines are strategically placed in lower wiring layers to provide noise shielding while allowing upper layers to be configured freely for redistribution functions.
2Adaptability or versatility
If redistribution layer is formed to relocate pads, then pad location flexibility is improved, but electric field noise generation increases affecting circuits and signal lines
Solution Approach 1:
The patent introduces ground lines as intermediary elements between the redistribution layer and underlying circuits. These ground lines act as mediators that intercept and shunt electric field noise generated by redistribution lines carrying signals to relocated pads. By positioning ground lines in lower wiring layers beneath the redistribution layer, the patent creates an intermediary shielding structure that allows pad relocation flexibility while mitigating noise generation.
3Reliability
If metal parts are restricted to regions without signal lines, then signal line integrity is improved, but shielding effectiveness deteriorates due to limited placement options
Solution Approach 1:
The patent resolves the placement conflict by transitioning to another dimension - utilizing vertical layering within the multilayer wiring structure. Instead of restricting ground lines to horizontal planes avoiding signal lines, the patent positions ground lines in lower wiring layers (vertical dimension) beneath redistribution lines. This dimensional separation allows ground lines to provide effective shielding without interfering with signal line integrity in upper layers, overcoming the two-dimensional placement limitation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables flexible design and reduced impact of electric field noise on circuits and signal lines, even when the layout of redistribution lines and new pads changes, by allowing ground lines to be laid out across multiple wiring layers, thereby enhancing noise shielding and operational stability.
Implementation Method 1
ground lines (3) which are laid out, in a multilayer wiring layer (22), along assumed routes of the redistribution lines (1) and assumed locations of the new pads (2)
Data Source
AI summary
A semiconductor device includes a substrate, a multi-layer wiring layer formed on the substrate, and including a signal line and ground lines extending above the signal line, one of the ground lines extending toward a direction in a layer and another one of the ground lines extending from the one of the ground lines toward another direction in the layer, a first pad on the multi-layer wiring layer, and a redistribution layer formed on the multi-layer wiring layer, including a second pad, a redistribution line coupling the first pad and the second pad, and an insulation film covering the redistribution line.