Sensor Array with Integrated Wells for Particle Detection
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Solution Overview
Problem
Conventional methods for manufacturing sensor arrays are complex and inefficient, making them difficult to produce and operate effectively for detecting particles in fluidic samples.
Innovation Solution
A sensor array comprising a substrate with multiple holes and monolithically integrated electronic sensor chips, connected via an electric contacting structure, forming wells that allow for direct fluidic sample analysis without external processing resources, enabling a lightweight, miniaturized, and cost-effective detection system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional methods are used for manufacturing sensor arrays, then manufacturing complexity is high, but production efficiency and cost-effectiveness deteriorate
Solution Approach 1:
The patent merges the sensor chip, substrate, and electric contacting structure into an integrated assembly where the sensor chip is mounted directly on the substrate with integrated electrical connections, eliminating the need for separate packaging and interconnection steps in conventional manufacturing methods
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides mechanical support, creates fluidic wells through its hole structure, provides electrical connections through integrated contacts, and enables direct fluidic access to sensor active regions, replacing multiple separate components in conventional designs
2Reliability
If sensor arrays require external processing resources, then detection capability is maintained, but device portability and operational simplicity deteriorate
Solution Approach 1:
The patent extracts the essential sensing function and integrates it directly into the sensor chip mounted on the substrate, allowing the sensor array to perform particle detection autonomously without requiring external processing equipment or complex support systems
3Productivity
If multiple sensors are integrated in parallel, then analysis throughput is improved, but manufacturing precision and alignment requirements worsen
Solution Approach 1:
The patent segments the sensor array into multiple identical sensor chips, each capable of independent particle detection, arranged in parallel on the substrate. This modular segmentation allows for standardized manufacturing and simplifies alignment compared to integrating multiple sensors into a single complex chip
Solution Approach 2:
The patent arranges multiple sensor chips in a two-dimensional array pattern on the substrate, utilizing spatial distribution in multiple dimensions to achieve high-throughput parallel detection while maintaining manageable alignment requirements through regular geometric patterns
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for efficient detection of particles with high spatial resolution and signal processing capabilities within the sensor array, reducing the need for external equipment and enabling high-throughput analysis with multiple sensors in parallel.
Implementation Method 1
When such attachment or sensor events occur at the sensor surface, this may change the optical properties of the surface which can be detected as the sensor event
Implementation Method 2
an electric contacting structure adapted for electrically contacting (for instance each of) the plurality of electronic sensor chips (for instance via electrically conductive bumps and/or via electrically conductive wires)
Data Source
AI summary
A sensor array for detecting particles, the sensor array comprising a substrate having a plurality of holes, a plurality of electronic sensor chips each having a sensor active region being sensitive to the presence of particles to be detected, and an electric contacting structure adapted for electrically contacting the plurality of electronic sensor chips, wherein the plurality of electronic sensor chips and/or the electric contacting structure are connected to the substrate in such a manner that the plurality of holes in combination with the plurality of electronic sensor chips and/or the electric contacting structure form a plurality of wells with integrated particle sensors.