Semiconductor Sensor Bus Segmentation for Capacitive Positioning
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Solution Overview
Problem
Current capacitive sensing devices face challenges in accurately determining positional information of input objects due to limitations in capacitive coupling measurement and signal processing, particularly in complex sensing regions with multiple electrodes and interference sources.
Innovation Solution
The implementation of a semiconductor device with sensor circuitry and a sensor bus that couples multiple sensor electrodes to transmitters and receivers, enabling efficient capacitive sensing by driving sensor electrodes with specific signals and receiving resulting signals to determine positional information based on changes in capacitive coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple sensor electrodes are used in a single layer for capacitive sensing, then the sensing capability and positional information determination are improved, but the complexity of signal processing and interference management increases
Solution Approach 1:
The sensor bus is segmented into multiple independent wires, each dedicated to coupling specific pads to specific transmitters or receivers. This segmentation allows independent signal processing paths, reducing the complexity of managing multiple electrodes while maintaining high measurement precision through dedicated signal channels.
Solution Approach 2:
The sensor bus acts as an intermediary structure between the pads and the sensor circuitry (transmitters and receivers). By introducing this intermediate coupling layer with multiple wires, the patent simplifies the connection architecture and signal processing while enabling accurate capacitive sensing across multiple electrodes.
2Productivity
If multiple sensor electrodes are coupled to transmitters and receivers through a sensor bus, then the capacitive sensing efficiency is improved, but the number of required connections and routing increases
Solution Approach 1:
Multiple pads are merged and coupled together through common wires in the sensor bus. Specifically, the first wire couples both the first pad and second pad to the first transmitter, and the second wire couples the third pad to the first receiver. This merging reduces the total number of separate connections required while maintaining efficient capacitive sensing across multiple electrodes.
Solution Approach 2:
The sensor bus wires are designed with multi-functionality, where a single wire can serve to couple multiple pads to a single transmitter or receiver. This universal coupling approach increases sensing efficiency by enabling parallel operation of multiple electrodes while reducing routing complexity through shared connection paths.
3Reliability
If pads are coupled to sensor electrodes with dedicated wires in a sensor bus, then the signal integrity for capacitive coupling measurement is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent transitions from planar routing to three-dimensional multi-layer routing for the sensor bus wires. By utilizing vertical stacking and multi-layer interconnect structures, the patent achieves improved signal integrity through dedicated wire paths while managing manufacturing complexity through standardized multi-layer PCB or interconnect technologies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the accuracy and efficiency of positional information determination for input objects, improving the overall performance of capacitive sensing devices by effectively handling complex sensing scenarios and reducing interference.
Implementation Method 1
determining positional information for an input object based on a measurement of a change in capacitive coupling between at least one of the first sensor electrode and the second sensor electrode and the third sensor electrode
Implementation Method 2
receiving, with a first receiver, a first resulting signal with a third sensor electrode coupled to a third pad of the semiconductor device
Data Source
AI summary
A semiconductor device for an input device comprises sensor circuitry, a plurality of contacts and a sensor bus. A first contact of the plurality of contacts is configured to be coupled to a first sensor electrode of the plurality of sensor electrodes, a second contact of the plurality of contacts is configured to be coupled to a second sensor electrode of the plurality of sensor electrodes, and a third contact of the plurality of contacts is configured to be coupled to a third sensor electrode of the plurality of sensor electrodes. The sensor bus comprises a plurality of traces. A first trace of the plurality of traces is configured to couple the first contact and the second contact to a first transmitter of the sensor circuitry and a second trace of the plurality of traces is coupled to the third contact to a first receiver of the sensor circuitry.