Image Sensor Heat Dissipation via Segmented Composite Substrate
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Solution Overview
Problem
Conventional image sensors face challenges in effectively dissipating heat generated during operation, which can lead to overheating and affect image quality and sensor performance.
Innovation Solution
The image sensor design incorporates a second layer with alternately arranged primary and secondary material regions, where the secondary material acts as a heat sink to efficiently dissipate heat generated in the first layer, improving thermal management without increasing manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional single-layer structure is used, then the device complexity is low, but the heat dissipation performance is insufficient leading to overheating
Solution Approach 1:
The support substrate is segmented into a multi-layer structure with alternating high-thermal-conductivity and low-thermal-conductivity layers. This segmentation allows heat to be efficiently conducted through the high-conductivity paths while maintaining structural integrity and reducing overall thermal resistance, thereby improving heat dissipation without excessive complexity increase
Solution Approach 2:
The patent employs composite material structure by combining materials with different thermal conductivity properties in alternating layers. The high-thermal-conductivity material (e.g., metal) is combined with low-thermal-conductivity material (e.g., resin or ceramic) to create a composite support substrate that optimizes heat dissipation while maintaining mechanical properties
2Temperature
If heat dissipation structures are added, then the heat dissipation performance improves, but the manufacturing complexity increases
Solution Approach 1:
The support substrate is divided into multiple alternating layers during the manufacturing process, allowing each layer to be formed and positioned systematically. This segmented approach enables controlled deposition of materials with different thermal conductivities, making the manufacturing process manageable while achieving superior heat dissipation
Solution Approach 2:
The patent controls the thickness and thermal conductivity parameters of each layer to optimize heat dissipation. By adjusting these parameters during manufacturing, the desired thermal performance is achieved without requiring overly complex manufacturing procedures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation, reducing the risk of overheating and improving image sensor performance by effectively conducting heat away from the heat-generating areas, thus maintaining optimal operating conditions.
Implementation Method 1
heat generated in the image sensor to escape through a heat conduction member to a metal plate
Data Source
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AI summary
An image sensor, an imaging apparatus, and a method of manufacturing an image sensor with an improved heat dissipation effect. An image sensor (12) includes a first layer (18) having an imaging function, pixels being arranged in the first layer (18) in at least a first direction, and a second layer (19) joined to the first layer (18). The second layer (19) includes a first sublayer (26), and primary material regions including primary material and secondary material regions including secondary material are arranged alternately in the first direction in the first sublayer (26).