Sensor-Integrated Display Substrate with Seal-Merged Electrical Connections
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Solution Overview
Problem
Existing display devices with integrated sensors face manufacturing complexities and increased thickness due to the need for electrical connections between substrates, which complicates the manufacturing process and increases costs.
Innovation Solution
A display device design where a sensor electrode unit is formed on the upper substrate with pad units on both substrates, allowing direct connection to driving elements without traditional conductive spacers, simplifying the manufacturing process and reducing thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional electrical connections between substrates are used, then reliable electrical connection is achieved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges the electrical connection function directly into the seal structure by forming conductive patterns on the seal member that electrically connects the sensor electrode on the second substrate to the driving element on the first substrate. This integration eliminates the need for separate conductive spacers or additional connection components, thereby reducing device complexity while maintaining reliable electrical connection.
2Reliability
If traditional conductive spacers are used for electrical connection, then electrical connection is achieved, but manufacturing process complexity increases
Solution Approach 1:
The seal member simultaneously performs sealing and electrical connection functions. The conductive patterns are formed directly on the seal member during the sealing process, eliminating the need for separate conductive spacer components and their associated alignment and bonding steps. This reduces manufacturing process complexity while ensuring reliable electrical connection between substrates.
3Reliability
If multiple connection components are used, then electrical connection reliability is improved, but device thickness increases
Solution Approach 1:
The electrical connection is achieved within the seal structure itself, which is already present at the edges of the display device. The conductive patterns on the seal member provide the electrical connection path without requiring additional thickness-consuming components like conductive spacers or intermediate connection layers. This maintains thin device profile while ensuring reliable electrical connection.
4Reliability
If traditional electrical connection methods are used, then connection reliability is achieved, but manufacturing costs increase
Solution Approach 1:
The seal member is manufactured to include integrated conductive patterns, eliminating the need for separate conductive spacer components and their associated manufacturing steps. This integration reduces material costs, simplifies the manufacturing process, and lowers overall production costs while maintaining reliable electrical connection between the sensor electrode and driving element.
Data Source
AI summary
A display device integrated with a sensor includes a first substrate and a second substrate disposed while facing each other, and having exposed ends at different sides thereof, a sealing material configured to seal an overlapping region between the first and second substrates, a display unit including a plurality of pixels provided in a sealed region inside the sealing material, a sensor electrode unit formed on the second substrate, a first pad unit formed in an exposed part of the first substrate, and a second pad unit formed in an exposed part of the second substrate.