Sensor-Guided Pick Arm Handling for Fragile Microelectronic Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing fragility of microelectronic devices due to reduced thickness, particularly below 50 μm, makes them susceptible to cracking during handling operations like pick and place, where stress and contamination issues exacerbate damage.
Innovation Solution
The implementation of a pick and place apparatus equipped with a force sensor device and acoustic crack sensors to monitor and control the forces applied during handling, thereby reducing stress-induced cracking and detecting potential damage in real-time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of microelectronic devices is reduced to maintain or shrink form factor, then the footprint and height of device assemblies are reduced, but the device fragility and susceptibility to cracking under stress increases
Solution Approach 1:
A force sensor device is integrated into the pick arm to provide real-time force feedback during handling operations. This allows the system to detect and respond to stress conditions before cracking occurs, effectively cushioning the thin microelectronic devices from damage during pick-and-place operations
2Volume of moving object
If bond line thickness is decreased to reduce assembly height, then bond line uniformity is improved, but the ability to accommodate particulate contaminants and provide cushioning effect is reduced
Solution Approach 1:
The force sensor device provides real-time feedback during handling operations, allowing the control system to adjust applied forces dynamically. This feedback mechanism compensates for the reduced cushioning effect of thinner bond lines by preventing excessive force application that could cause damage or dislodge particulate contaminants
3Productivity
If conventional pick and place handling is used for thin microelectronic devices, then handling speed is maintained, but stress-induced cracking occurs during manipulation
Solution Approach 1:
The patent replaces conventional mechanical force application with a sensor-guided force control system. The force sensor device monitors and limits the forces applied during pick-and-place operations, substituting blind mechanical handling with instrumented, feedback-controlled manipulation that prevents stress-induced cracking while maintaining handling speed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the likelihood of microelectronic device damage during handling by minimizing stress and detecting cracks early, leading to improved yield and reduced infant mortality in device assemblies.
Implementation Method 1
a force sensor device and acoustic crack sensors to monitor and control the forces applied during handling
Implementation Method 2
a force sensor device and acoustic crack sensors to monitor and control the forces applied during handling
Data Source
AI summary
An apparatus for handling microelectronic devices comprises a pick arm having a pick surface configured for receiving a microelectronic device thereon, drives for moving the pick arm and reorienting the pick surface in the X, Y and Z planes and about a horizontal rotational axis and a vertical rotational axis, and a sensor device carried by the pick arm and configured to detect at least one of at least one magnitude of force and at least one location of force applied between the pick surface and a structure contacted by the pick surface or a structure and a microelectronic device carried on the pick surface.