Sensor Device Interposer for Four-Sided Buttable Radiation Detection

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Solution Overview

Problem

Existing sensor devices for radiation detection in imaging technologies, such as CT and Spectral CT, face limitations in signal integrity and cost efficiency while attempting to provide comprehensive coverage and high image resolution.

Innovation Solution

A sensor device comprising a sensor array with detectors, an interposer element, and an integrated circuit, where the interposer element extends laterally between the sensor element and the integrated circuit, facilitating high structural stability, efficient signal routing, and four-sided tileability, thereby enhancing signal integrity and cost efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If sensors are arranged to be four-sidedly buttable to provide large area coverage, then area coverage is improved, but signal integrity deteriorates due to strain effects and signal interferences at detector boundaries

Engineering Contradiction:
Improvearea coverageVSAvoidsignal integrity
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The patent introduces an interposer element as an intermediary component between adjacent detectors. This interposer element includes a strain relief structure that mechanically decouples the detectors from each other, preventing strain propagation across detector boundaries. The interposer acts as a mediator that maintains structural continuity while isolating detectors from mechanical stress, thereby preserving signal integrity during four-sided butting arrangements.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent segments the detector array into independent detector units, each surrounded by its own interposer element. This segmentation allows each detector to be independently mounted and isolated from strain effects originating in adjacent detectors. The modular structure with interposers between each detector enables four-sided butting while maintaining signal integrity through mechanical isolation.

Inventive Principle:
Principle #1Segmentation

2Measurement precision

If detectors are arranged in a four-sided buttable configuration to achieve high image resolution, then image resolution is improved, but device complexity increases due to the need for interposer elements and strain relief structures

Engineering Contradiction:
Improveimage resolutionVSAvoiddevice complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent merges multiple functions into the interposer element: it provides mechanical support for the detector, incorporates strain relief structures to prevent strain propagation, and facilitates thermal management. By combining these functions into a single integrated component rather than separate elements, the design reduces overall device complexity while maintaining the ability to achieve four-sided butting for high-resolution imaging.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The interposer element is designed as a universal component that serves multiple purposes: mechanical support, strain isolation, thermal management, and electrical isolation. This multi-functional design eliminates the need for separate components for each function, thereby reducing device complexity while enabling high-resolution four-sided buttable detector arrangements.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If interposer elements are used to isolate detectors and improve signal integrity, then signal integrity is improved, but manufacturing cost increases

Engineering Contradiction:
Improvesignal integrityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent employs parameters such as varying the thickness of the interposer element and adjusting the dimensions of the strain relief structures to optimize both signal integrity and manufacturing cost. By carefully selecting these parameters, the design achieves effective strain isolation without requiring excessively thick or complex interposer structures that would increase manufacturing costs.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The strain relief structures within the interposer element are strategically positioned only at critical locations where strain propagation would affect detector performance. Rather than making the entire interposer uniformly thick or complex, the design applies enhanced structural features only where needed, reducing material usage and manufacturing cost while maintaining signal integrity.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables high signal integrity and cost-efficient detection of radiation signals, allowing for large area coverage and high image resolution, while minimizing unwanted strain effects and signal interferences, thus improving the quality of medical images.

Implementation Method 1

a sensor element for converting the received radiation signals into a plurality of corresponding electric signals

Methodology Applied
Scientific EffectDirect conversion: Photoelectric Effect

Data Source

PatentUS9955930B2Sensor device and imaging system for detecting radiation signals
Publication Date: 2018.05.01 KONINKLIJKE PHILIPS NV
  • US9955930B2 patent drawing
  • US9955930B2 patent drawing
  • US9955930B2 patent drawing

AI summary

The present invention relates to a sensor device for detecting radiation signals. To enable high signal integrity and cost efficiency while maintaining the capability of being four-sidedly buttable, the proposed sensor device comprises a sensor array (22) comprising a plurality of detectors (11, 11a-d), a sensor element (14) for converting said received radiation signals (74, 74′) into a plurality of corresponding electric signals, an interposer element (16, 16a-d) extending laterally between a first side (28) and a second side (30), and an integrated circuit element (18, 18a-d). The interposer element (16, 16a-d) comprises a front surface (24) facing said sensor element (14) and a back surface (26) parallel to said front surface (24), wherein a front contact arrangement (36) is provided on said front surface (24) for directing said electric signals to a back contact arrangement (40) provided on said back surface (26). The integrated circuit element faces said back surface (26) and is electrically connected to said back contact arrangement (40).