Sensor Module Enclosure Design Eliminating PCB Carrier
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Solution Overview
Problem
Conventional micromechanical sensor packaging requires a p.c. board as an intermediate carrier, leading to increased size, complexity, and cost, as well as susceptibility to interference and environmental influences.
Innovation Solution
A module design where the inner enclosure with first electrical contact means is directly connected to the outer enclosure with second electrical contact means, eliminating the need for a p.c. board, and incorporating a micromechanical sensor element with electromagnetic shielding, using connections like welds, solder, or wire bonds, and integration of structural components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a p.c. board is used as an intermediate carrier to mount sensor elements, then the sensor can be assembled and contacted, but the size, complexity, and cost increase
Solution Approach 1:
The patent extracts and eliminates the p.c. board (intermediate carrier) from the sensor assembly structure. The sensor element is mounted directly in the outer enclosure without requiring a separate p.c. board, thereby reducing structural complexity while maintaining assembly feasibility through direct mounting and contacting methods
Solution Approach 2:
The patent merges the functions of the p.c. board (mounting carrier and electrical contact medium) directly into the outer enclosure. The outer enclosure simultaneously serves as the mounting structure and provides electrical contact means, eliminating the need for a separate intermediate carrier
2Ease of operation
If a p.c. board is used as an intermediate carrier, then the sensor can be mounted and contacted, but the size increases
Solution Approach 1:
The patent removes the p.c. board from the sensor module structure, eliminating the intermediate carrier that contributed to increased size. The sensor element is mounted directly in the outer enclosure, reducing the overall volume of the sensor module while maintaining mounting and contacting functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces size and manufacturing costs, enhances protection against interference and environmental factors, and allows for more efficient assembly and sealing techniques, such as casting or extrusion, without compromising quality.
Implementation Method 1
The first and second contact means are interconnected by a weld connection, a solder connection, a press connection or a wire bond connection
Implementation Method 2
The first and second contact means are interconnected by a weld connection, a solder connection, a press connection or a wire bond connection
Data Source
AI summary
A module includes an electrical component having an inner enclosure which surrounds the electrical component and which has first electrical contact means at least on one outer side; having an outer enclosure in the interior of which the inner enclosure is situated, the outer enclosure having second electrical contact means, the second electrical contact means extending from the interior to at least one outer side of the outer enclosure. The first and second contact means are interconnected.