Sensor Module Pad Arrangement for Stack and Side-by-Side Mounting
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Solution Overview
Problem
Existing sensor modules face challenges in miniaturization and cost-effectiveness due to the need for re-manufacturing and re-arrangement of sensor and processing circuit chips when transitioning between side-by-side and chip stack structures, which affects detection accuracy and increases development costs.
Innovation Solution
A sensor module configuration with differential type sensor chips and processing circuit chips, where sensor pads are arranged to face the outer circumference, allowing for both side-by-side and chip stack structures without changing the pad arrangement, and incorporating polarity or sets switching units to maintain detection accuracy and reduce costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the sensor chip is translated and mounted on the processing circuit chip to achieve chip stack structure, then the module size is reduced, but the bonding wires pass through the upper portion of the detection unit causing detection accuracy to deteriorate
Solution Approach 1:
The sensor chip is rotated by 90 degrees relative to the processing circuit chip, creating an asymmetric arrangement where the sensor chip's long side is perpendicular to the processing circuit chip's long side. This asymmetric orientation allows the bonding wires to connect to pads positioned at the corners of the sensor chip, routing them away from the detection unit area and eliminating the interference that would occur with direct translation mounting.
2Measurement precision
If the sensor chip is rotated and mounted on the processing circuit chip to avoid bonding wire interference, then detection accuracy is improved, but the pad arrangements become unmatched requiring re-manufacturing and increasing development cost
Solution Approach 1:
The sensor chip is designed with a universal pad arrangement pattern where pads are positioned at all four corners and along the edges, allowing the same chip design to be used in both side-by-side and chip stack structures. The processing circuit chip similarly has pads arranged to accommodate both mounting orientations, enabling a single sensor chip design to serve multiple application scenarios without re-manufacturing.
3Adaptability or versatility
If the sensor chip and processing circuit chip are separately molded and connected by the user, then each module can be realized independently, but the size is enlarged and performance and reliability are adversely affected
Solution Approach 1:
The sensor chip and processing circuit chip are housed together in a single molded package, merging what were previously separate modules into one integrated unit. The molding process encapsulates both chips along with their interconnections, creating a single reliable module that eliminates the need for external connection while maintaining the ability to independently design and manufacture each chip before final assembly.
Data Source
AI summary
A sensor chip includes sensor pads, and the first set of differential detection signal pads are symmetrically arranged on both sides of a ground pad and are centered at the ground pad, the second set of differential detection signal pads are arranged on both sides thereof, and a power supply pad is arranged in one end of the two ends of the sensor pads. A processing circuit chip includes sensor connection pads including power supply connection pads, a ground connection pad, and two sets of differential detection signal connection pads, and the power supply connection pads connectable to the power supply pad of the sensor chip are arranged in two ends of the sensor connection pads.