Sensor Unit Mount Board Thermal Expansion Suppression
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Solution Overview
Problem
Miniaturization of sensor units leads to complex wiring configurations, causing bias shifts in temperature characteristics due to thermal expansion, which compromises measurement reliability.
Innovation Solution
A mount board design with insulation parts and wiring configurations that prevent wiring overlap with the sensor unit, using insulation layers, recessed parts, or through holes to absorb and dissipate thermal expansion, ensuring that distortion is suppressed in the sensor mounting region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If wiring is provided in the mount region overlapping the sensor, then wiring complexity is reduced and miniaturization is achieved, but bias shift occurs in temperature characteristics due to thermal expansion
Solution Approach 1:
The mount region is divided into a first portion containing mount terminals and a second portion containing insulation parts. This segmentation allows wiring to be routed through the first portion while the second portion remains free of wiring, preventing thermal expansion-induced distortion from affecting the sensor mounted in the second portion.
Solution Approach 2:
The insulation parts are extracted and placed specifically in the second portion of the mount region, creating a wiring-free zone. This extraction of insulating material to specific locations prevents wiring from overlapping the sensor while maintaining electrical insulation where needed.
2Reliability
If wiring is made of conductive material and provided in overlapping region, then electrical connection is achieved, but thermal expansion causes distortion in the sensor
Solution Approach 1:
Different portions of the mount region have different properties: the first portion has mount terminals for electrical connection, while the second portion has insulation parts that prevent thermal expansion distortion. This local differentiation allows both electrical connectivity and dimensional stability to be achieved in appropriate locations.
Solution Approach 2:
The insulation parts act as intermediaries between the wiring and the sensor mounting region. By placing insulation parts in the second portion, they mediate the thermal expansion effects, preventing direct transmission of distortion to the sensor while allowing wiring to maintain electrical connections in the first portion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design maintains excellent temperature characteristics by preventing distortion and bias shifts in the sensor unit, enhancing measurement reliability and stability.
Implementation Method 1
distortion of the base member due to thermal expansion of the wiring or the like is suppressed from occurring in the mount region
Data Source
AI summary
A sensor unit includes a sensor and a mount board on which the sensor is mounted. The mount board includes a mount terminal connected to a terminal provided in the sensor and a wiring extending from the mount terminal. The wiring is not provided in a region where the sensor and the mount board overlap each other when viewed in plan.