A MEMS accelerometer merges capacitors to detect acceleration along two perpendicular axes parallel to the substrate.
Grain growth inhibitors enable low-stress tungsten deposition below 500°C, resolving internal stress warping in thick MEMS structures.
Recessed silicon regions filled with compliant glue and plug materials add mass to MEMS structures while isolating substrate stress.
A physical quantity sensor uses a support member with a smaller surface area than the package to alleviate thermal stress and reduce noise interference.
A two-axis MEMS gyroscope detects rotation using orthogonal proof masses and Coriolis electrodes.
A lid separates drive and detection terminals in an inertial sensor to minimize noise interference.
Vertical acceleration sensor calculates speed using characteristic maximum and minimum values during step cycles.
Deep learning corrects MEMS sensor errors to improve attitude estimation accuracy without requiring expensive hardware upgrades.
A motion sensor system computes energy distributions from movement data to generate stability assessments.
Computing apparatus detects correct sensor placement using gyroscope and accelerometer heading data.
Segregated wiring and insulation parts on a sensor mount board absorb thermal expansion, preventing bias shifts in temperature characteristics.
A piezo mirror retro-reflects optical signals to create non-symmetric counter-propagating lightwave pairs for atomic interferometry.
Opposing spring extensions constrain the stop gap below minimum etch size limits, preventing proof mass chipping during harsh accelerations.
A common mobile seismic element connects two resonator cells to absorb thermal deformations and limit parasitic stresses on measurement accuracy.
A capacitive MEMS device stacks mobile and fixed electrodes in separate vertical layers to enable a narrow air gap.
Silicon-on-insulator substrate eliminates glass polishing limits, reducing thickness and fabrication complexity for stable MEMS sensors.
Radial acceleration sensor detects wheel signal extrema to estimate tire external radius, eliminating dedicated wear sensors and reducing system complexity.
Segmented compensation structures measure anchor position shifts caused by packaging stress, correcting acceleration signals for higher measurement precision.
Integrating environmental sensors within the insulin pump casing records temperature and acceleration data to resolve speculative post-failure analysis.
Plain optical fibers measure erosion depth via light reflection, avoiding complex Bragg grids and thermal insulation limits.
A diffractive grating sensor modulates light intensity to detect lateral displacement with high sensitivity.
Bi-stable spring mechanism counteracts optical fiber tension to amplify sensor response, resolving size sensitivity trade-offs.
Out-of-phase proof mass movement enables processing circuitry to extract self-test signals from linear acceleration data in MEMS accelerometers.
Segmenting the circuit carrier with a slit directs vibration away from the sensing region, preventing mechanical interference with measurement signals.
An elliptical metallic membrane switch boosts restoring force while lowering contact resistance, preventing plastic deformation in compact RF devices.
Segmented slits in the movable portion connection part distribute impact stress, preventing damage at critical joints while maintaining measurement accuracy.
Segmented acceleration thresholds enable a mobile processor to detect crashes and report precise location data, eliminating manual reporting delays.
A nested proof mass structure enables multi-axis acceleration and magnetic field detection on a single chip.
Strategic dummy electrode placement resolves the trade-off between detection sensitivity and damping in inertial sensors.
On-chip interpolation corrects sampling errors from manufacturing variability without increasing power consumption.
A sacrificial germanium layer enables selective self-assembled monolayer deposition on MEMS proof masses.
A passive wireless ultrasound sensor uses radio frequency signals to drive an ultrasonic transmitter without embedded integrated circuits.
A daughter board assembly connects to a main circuit via a flexible electrical connector to isolate sensor components from structural vibrations.
A switching control circuit reconfigures an external terminal between internal nodes and a constant potential source.
Gaseous etching creates vertical gaps beneath non-perforated mass elements, reducing electrostatic offset while maintaining mechanical sensitivity.
Segmented AD conversion with dual registers resolves the trade-off between measurement precision and circuit area in acceleration sensors.
A Z-axis microelectromechanical detection structure uses a suspended electrode arrangement to maintain sensitivity.
A physical quantity sensor uses a protection film to shield exposed conductor patterns from dry etching damage.
Electromagnetic actuation shifts resonance frequencies to counter broadband rotor vibrations, preventing flutter-induced mechanical failure.
A single chip combines inertial and pressure sensors using a unified process flow to reduce footprint.
A wheel sensor unit measures longitudinal and vertical acceleration signals to extract tire modes for wear state estimation.
A common proof mass detects in-plane and out-of-plane acceleration through differential sensing.
A master laser and slave laser with an optical phase-locked loop stabilize frequencies, reducing bulk and cost of cold-atom inertial sensors.
Curved C-shaped flexure bearings cancel out-of-plane motion to reduce quadrature errors caused by fabrication imperfections in micromachined gyroscopes.
Trim voltage adjusts electrostatic force against spring force, minimizing bias instability from manufacturing tolerances.
Protective glove detects hand motion and relative object movement to evaluate risk levels, alerting users before contact occurs.
Multi-layer movable combs balance fringing electric fields to minimize drive-induced bias errors and enhance rotation rate measurement accuracy.
Wireless transmission of pulse data from a wearable band to a cellular telephone reduces device complexity and manufacturing cost.
Capacitive sensing and PID feedback balance external forces to achieve piconewton measurement precision.
Opposing symmetric proof masses minimize cross-axis error and parasitic modes, enabling high accuracy and low noise performance in multi-axis sensing.