Semiconductor Sensor Package Cover Structure Protection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional glass covers for semiconductor sensor packages are susceptible to damage during encapsulation, compromising the integrity of the sealed cavity and package reliability.
Innovation Solution
A semiconductor package design featuring a primary cover structure with a secondary cover structure that surrounds and protects the primary cover from encapsulation stress, using a secondary cover structure formed from an epoxy mold compound to withstand stress and maintain package integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a transparent glass cover is used over the sensor area, then light transmission to the sensor is enabled and a sealed cavity is created, but the glass cover is susceptible to damage from encapsulation stress
Solution Approach 1:
The cover structure is divided into two separate components: a primary cover (glass or transparent material) that provides light transmission and sealing, and a secondary cover (epoxy mold compound) that provides mechanical protection. This segmentation allows each component to specialize in its intended function without compromising the other.
Solution Approach 2:
The patent combines two different materials with complementary properties: transparent glass or plastic for the primary cover to maintain optical clarity and hermetic sealing, and epoxy mold compound for the secondary cover to provide stress resistance and structural support during encapsulation.
2Object-affected harmful factors
If an encapsulant is provided over the chip to encapsulate the periphery and sides, then the chip is protected from the environment, but the encapsulant exerts stress on the glass cover causing damage
Solution Approach 1:
The secondary cover structure is formed over the primary cover before the encapsulation process, creating a protective cushion that absorbs and distributes the stress from the subsequent encapsulant application, preventing direct transmission of harmful forces to the primary cover.
Solution Approach 2:
The secondary cover acts as an intermediary layer between the encapsulant and the primary cover structure, mediating the mechanical stress by providing a compliant interface that protects the fragile primary cover while still allowing the encapsulant to fulfill its protective function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively protects the primary cover structure from damage during packaging, enhancing the reliability of semiconductor sensor packages by maintaining a sealed cavity and ensuring the integrity of the sensor area.
Implementation Method 1
applying a double-sided adhesive tape on the processing surface
Implementation Method 2
The cover structure is configured to attach the cover structure to the die to form a sealed cavity between the cover structure and sensor region
Data Source
AI summary
A semiconductor package is disclosed. The package includes a sensor die which is disposed on a package substrate. A cover structure is attached to a cover adhesive surrounding the sensor die, forming a cavity above the sensor die. The cover structure includes a primary cover structure and a secondary cover structure surrounding the primary cover structure. The secondary cover structure is configured to protect the primary cover structure from damage during packaging. The package also includes an encapsulant. The encapsulant covers side surfaces of the cover structure, sides of the cover adhesive, and exposed portions of the package substrate, leaving the first major cover surface exposed.