Sensor Package Diagnostic Interface Using Supply Current Modulation

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Solution Overview

Problem

Existing semiconductor packages with limited external terminals face challenges in providing diagnostic information without adding additional terminals, which complicates system design and increases costs, especially in safety-critical applications like automotive systems.

Innovation Solution

A three-terminal packaged device with an integrated circuit that includes a sensing element, sensor circuit, and diagnostic circuit, which modulates current paths to provide diagnostic information without requiring additional external terminals, using current modulator components to encode fault conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If additional external terminals are added to provide diagnostic information, then diagnostic capability is improved, but device complexity and system design complexity increase

Engineering Contradiction:
Improvediagnostic capabilityVSAvoidsystem design complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The existing external terminals are made multi-functional by enabling them to transmit both power supply signals and diagnostic information. The diagnostic circuit controls current modulator components to encode diagnostic information in the current flowing through existing terminals, allowing these terminals to serve dual purposes without adding new connection points.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent changes the operational parameters of existing terminals by modulating the current flowing through them. The diagnostic circuit varies current characteristics (presence, absence, modulation patterns) of the current through existing terminals to encode diagnostic information, transforming these terminals from simple power carriers into information transmission channels.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If additional external terminals are added to provide diagnostic information, then diagnostic capability is improved, but manufacturing costs increase

Engineering Contradiction:
Improvediagnostic capabilityVSAvoidmanufacturing costs
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The existing external terminals are made multi-functional by enabling them to transmit both power supply signals and diagnostic information. The diagnostic circuit controls current modulator components to encode diagnostic information in the current flowing through existing terminals, allowing these terminals to serve dual purposes without adding new connection points.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If current modulator components are used to encode diagnostic information in existing terminals, then diagnostic information transmission is enabled without additional terminals, but device complexity increases

Engineering Contradiction:
Improvediagnostic information transmissionVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the diagnostic information transmission function with the existing power supply current path. The current modulator components are integrated into the existing terminal structure, combining power delivery and diagnostic communication functions into a unified system that uses shared physical infrastructure.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The current modulator components act as intermediaries that translate diagnostic information from the diagnostic circuit into modulated current signals that can be transmitted through the existing power terminals. These intermediaries enable information encoding without requiring new transmission channels.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables diagnostic information transmission within existing system designs, enhancing safety features by maintaining compatibility and reducing complexity and costs, while ensuring reliable operation in safety-critical applications.

Implementation Method 1

a current modulator component arranged in the current path, wherein the current modulator component is configured to modulate a voltage at the first supply terminal or at the second supply terminal by modulating the current flowing along the current path

Methodology Applied
Scientific EffectElectrical Conductivity: Conduction (electrical)

Data Source

PatentUS20250271516A1Diagnostic interface for sensor package
Publication Date: 2025.08.28 INFINEON TECHNOLOGIES AG
  • US20250271516A1 patent drawing
  • US20250271516A1 patent drawing
  • US20250271516A1 patent drawing

AI summary

A sensor system includes a sensor package including an integrated circuit and a plurality of external terminals including a first supply terminal, a second supply terminal, and an output terminal configured to provide an output signal. The integrated circuit includes a sensor circuit configured to modulate the output signal based on a sensor signal; a current path coupled between the first supply terminal and the second supply terminal and configured to enable a current to flow along the current path from the first supply terminal to the second supply terminal; a current modulator component arranged in the current path and configured to modulate the current flowing along the current path; and a diagnostic circuit configured to generate diagnostic information based on one or more conditions of the integrated circuit, and control the current modulator component such that the current is modulated based on the diagnostic information.