Sensor Package Structure with Embedded Electronic Chip
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Solution Overview
Problem
Conventional sensor package structures face defects and air bubbles due to the suspension of larger chips during wire-bonding, which makes it difficult to fill gaps between chips and substrates effectively.
Innovation Solution
A sensor package structure where the electronic chip is embedded in a sealant or adhesive layer, with a sensor chip positioned on the sealant to withstand forces and prevent air bubbles, using flip-chip bonding and a light-permeable sheet with metal wires embedded in a package body to ensure secure electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire-bonding is used to electrically connect the larger chip to the substrate, then electrical connection is achieved, but the periphery portion of the larger chip is suspended and defects are induced in the package structure
Solution Approach 1:
The patent applies preliminary action by embedding the electronic chip in the sealing compound before the wire-bonding process. This pre-embedding provides structural support to the periphery portion of the larger chip, preventing suspension and force-induced defects during subsequent wire-bonding operations.
Solution Approach 2:
The sealing compound acts as an intermediary material between the substrate and the larger chip. By embedding the electronic chip in the sealing compound, the structure provides mechanical support and eliminates the harmful suspension effect during wire-bonding, thereby improving package structure integrity.
2Reliability
If wire-bonding is used for electrical connection, then electrical connectivity is established, but gaps between chips and substrate are difficult to fill entirely, causing air bubbles
Solution Approach 1:
The patent performs preliminary action by completely filling the sealing compound around the electronic chip before wire-bonding. This ensures that gaps between chips and substrate are entirely filled, preventing air bubble formation while maintaining electrical connection capability.
Solution Approach 2:
The patent merges the electrical connection function with the gap-filling function by using the sealing compound to both embed the electronic chip and fill all gaps. This combined approach ensures complete gap filling without air bubbles while still achieving reliable electrical connection through the wire-bonding process.
3Reliability
If a larger sensor chip is used, then sensing capability is improved, but the chip cannot be fully supported during wire-bonding, leading to structural defects
Solution Approach 1:
The patent applies preliminary action by embedding the electronic chip in the sealing compound before wire-bonding. This provides structural support to the larger sensor chip, enabling it to withstand forces during wire-bonding without developing defects, thereby maintaining both sensing capability and structural strength.
Solution Approach 2:
The patent uses composite material structure where the electronic chip is embedded in the sealing compound. This composite structure combines the sensing functionality of the larger chip with the mechanical support properties of the sealing compound, achieving both improved sensing capability and adequate support strength during wire-bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents air bubbles and supports the sensor chip during wire bonding, reducing manufacturing costs and avoiding short circuits by embedding the electronic chip in the sealant and using flip-chip bonding instead of wire-bonding.
Implementation Method 1
The electronic chip is fixed on the substrate by flip-chip bonding
Implementation Method 2
The bottom surface of the sensor chip is adhered to a top side of the adhesive layer
Data Source
Figure 1
Figure 2
AI summary
A sensor package structure (100) includes a substrate (1), an electronic chip (2) fixed on the substrate (1) by flip-chip bonding, a sealant (3) disposed on the substrate (1) and embedding the electronic chip (2) therein, a sensor chip (4) with a size larger than that of the electronic chip (2), a light-permeable sheet (5), a plurality of metal wires (6) electrically connected to the substrate (1) and the sensor chip (4), and a package body (7). A bottom surface (42) of the sensor chip (4) is disposed on the sealant (3) to be spaced apart from the electronic chip (2). A lateral surface (43) of the sensor chip (4) is horizontally spaced apart from that of the sealant (3) by a distance (Da, Db) less than or equal to 3mm. The package body (7) is disposed on the substrate (1) and covers the metal wires (6) as well as the lateral sides (31) of the sealant (3) and the sensor chip (4). The light-permeable sheet (5) is fixed above the sensor chip (4) through the package body (7).