Sensor Package Encapsulation for Compact Water-Resistant Integration
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Solution Overview
Problem
There is a need for a sensor package that integrates both a sensor and other electronic components into a single, compact package to meet the growing demands of automotive and wearable device markets, while existing technologies typically manufacture these components separately.
Innovation Solution
A method and package design that includes a substrate with connectors, a first encapsulant layer exposing these connectors, a sensor assembly with an optical filter and transparent mold, and a second encapsulant layer to encapsulate the assembly, allowing for integration of sensors and electronic components within a smaller form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If sensor and electronic components are manufactured separately, then manufacturing process is simple, but package size is large and integration is low
Solution Approach 1:
The patent merges the sensor and electronic components into a single integrated package structure. The sensor chip is mounted on a substrate that also carries electronic components, with both elements enclosed within a unified housing and sealed with a common sealing ring, achieving high integration while maintaining a compact form factor.
Solution Approach 2:
The patent employs a nested arrangement where the sensor chip is positioned within the housing, electronic components are mounted on the substrate surrounding the sensor, and all elements are enclosed within the same housing volume. This nested configuration maximizes space utilization and reduces overall package size.
2Volume of moving object
If multiple components are integrated into single package, then package size is reduced, but protection against environmental factors becomes challenging
Solution Approach 1:
The patent uses a sealing ring that forms a flexible yet effective barrier around the sensor and electronic components. This sealing structure conforms to the package geometry and provides comprehensive protection against moisture and environmental contaminants while maintaining the compact integrated design.
Solution Approach 2:
The patent employs composite construction with a housing made of protective material, a sealing ring providing environmental barrier, and a substrate combining mechanical support with electrical connectivity. This multi-material approach enhances protection against environmental factors while maintaining compact integration.
3Ease of operation
If connectors are exposed on substrate, then electrical connection is accessible, but water penetration risk increases
Solution Approach 1:
The patent positions the connectors on the substrate before final assembly, allowing pre-connection of electrical traces and contact points. The sealing ring is then installed to enclose these pre-positioned connectors, providing water resistance while maintaining electrical connectivity functionality.
Solution Approach 2:
The sealing ring acts as an intermediary element that bridges the need for electrical connection accessibility and water resistance. It allows connectors to be positioned and connected while simultaneously providing a protective barrier that prevents water penetration to the electrical interfaces.
Data Source
AI summary
A method for forming a sensor package is disclosed. The method comprises: providing a sensor; forming an optical filter and a transparent mold on the sensor to form a sensor assembly; providing a substrate, wherein one or more connectors are attached on a front surface of the substrate; forming a first encapsulant layer on the front surface of the substrate, wherein the one or more connectors are exposed from the first encapsulant layer; disposing the sensor assembly on the first encapsulant layer; connecting the sensor with the one or more connectors; and forming a second encapsulant layer on the first encapsulant layer to cover the sensor assembly.