Sensor Package Structure With Grooved Shielding to Reduce Glare
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Solution Overview
Problem
Conventional sensor package structures experience glare due to light reflection from the glue layer and are prone to deformation and peeling issues during the solidification process, which affects the accuracy and reliability of the sensor chip.
Innovation Solution
A sensor package structure incorporating a grooved shielding layer that blocks visible light and limits the deformation of the supporting layer, comprising an inner and outer barrier forming a ring-shaped groove, which reduces glare and prevents outward deformation, thereby maintaining the integrity of the light-permeable layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a glue layer is used to surround the sensing region of the sensor chip, then the sensor chip is protected and electrically coupled to the substrate, but light passing through the glass board is reflected by the glue layer causing glare phenomenon that affects sensing accuracy
Solution Approach 1:
The patent extracts the harmful function of the glue layer by introducing a shielding layer that blocks visible light from reaching the glue layer, thereby eliminating the glare phenomenon while preserving the glue layer's protective and electrical coupling functions
Solution Approach 2:
The shielding layer acts as an intermediary between the glass board and the glue layer, blocking visible light from reaching the glue layer and preventing light reflection that causes glare, while allowing the glue layer to maintain its structural and electrical functions
2Strength
If the glue layer is used to bond the glass board above the sensor chip, then the components are held together, but air trapped inside the glue layer pushes outwardly against the glue layer during solidification causing deformation or offset
Solution Approach 1:
The shielding layer is positioned beforehand to define a confined space that restricts the movement of the glue layer during solidification, preventing air expansion from causing deformation or offset while still allowing the glue layer to provide bonding strength
Solution Approach 2:
The shielding layer creates a localized confined space around the glue layer, allowing the glue layer to have different properties in different regions - free to bond strongly where needed but constrained in its outward expansion to prevent deformation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The grooved shielding layer effectively reduces glare and prevents deformation of the supporting layer, enhancing the accuracy and reliability of the sensor package by blocking visible light and maintaining the structural integrity of the light-permeable layer.
Implementation Method 1
The grooved shielding layer is disposed on the lower surface of the light-permeable layer for blocking a visible light from passing therethrough
Data Source
AI summary
A sensor package structure is provided and includes a substrate, a sensor chip mounted on the substrate, a supporting layer being ring-shaped and disposed on the sensor chip, a light-permeable layer, and a grooved shielding layer that is ring-shaped and that is disposed on a lower surface of the light-permeable layer. The grooved shielding layer includes an inner barrier and an outer barrier respectively located at two opposite sides of the supporting layer. An inner edge of the inner barrier has an opening directly located above a sensing region of the sensor chip. The inner barrier, the outer barrier, and a part of the lower surface of the light-permeable layer jointly define a ring-shaped groove. The part of the lower surface of the light-permeable layer is disposed on the supporting layer, so that a part of the supporting layer is arranged in the ring-shaped groove.