Sensor Package Structure with Protrusions for Moisture Sealing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional sensor package structures are prone to moisture infiltration through the connection interface between the adhesive and the substrate, which can affect the sensing function of the sensor chip.
Innovation Solution
A sensor package structure that includes a substrate with protrusions embedded in and gaplessly connected to a ring-shaped wall, along with a light-permeable layer, to increase the contact area and connection strength between the substrate and the ring-shaped wall, thereby lengthening the moisture travel path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a glass board is fixed onto a substrate through an adhesive, then the interior space is formed to accommodate the sensor chip, but moisture can easily seep into the interior space through the connection interface between the adhesive and the substrate
Solution Approach 1:
The connection interface is segmented into multiple protrusions distributed across the substrate surface, dividing the single adhesive interface into multiple smaller connection points. This segmentation increases the total contact area and creates a more complex moisture penetration path, effectively reducing moisture infiltration while maintaining structural integrity.
Solution Approach 2:
The connection interface is transformed from a two-dimensional planar adhesive layer to a three-dimensional structure with protrusions extending vertically from the substrate. This dimensional change increases the connection strength through greater surface area and creates a tortuous path for moisture, preventing direct linear penetration through the adhesive interface.
2Strength
If the contact area between the substrate and the ring-shaped wall is increased through protrusions, then the connection strength is improved, but the device complexity increases
Solution Approach 1:
The protrusions are integrated directly into the substrate structure during substrate formation, merging the connection features with the base substrate manufacturing process. This integration avoids the need for separate attachment steps or additional components, increasing connection strength while minimizing the increase in overall device complexity.
Solution Approach 2:
The protrusions are formed as inherent features of the substrate itself, allowing the substrate to provide its own connection enhancement without requiring external fasteners, adhesives, or additional joining mechanisms. This self-service approach strengthens the connection while keeping the device structure simple and self-contained.
Data Source
AI summary
A sensor package structure is provided. The sensor package structure includes a substrate, a sensor chip, a ring-shaped wall, and a light-permeable layer. The substrate has a first surface and a second surface that is opposite to the first surface. The first surface of the substrate has a chip-bonding region and a connection region that surrounds the chip-bonding region, and the substrate has a plurality of protrusions arranged in the connection region. The sensor chip is disposed on the chip-bonding region of the substrate and is electrically coupled to the substrate. The ring-shaped wall is formed on the connection region of the substrate, and the protrusions of the substrate are embedded in and gaplessly connected to the ring-shaped wall. The light-permeable layer is disposed on the ring-shaped wall, and the light-permeable layer, the ring-shaped wall, and the substrate jointly define an enclosed space therein.