Chip-Scale Sensor Package with Ring Support and RDL
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Solution Overview
Problem
Conventional chip-scale sensor package structures face contamination issues due to adhesives used to fix light permeable members, which can affect the sensing region and lead to production failures.
Innovation Solution
A chip-scale sensor package structure is designed with a ring-shaped support positioned on the top side of the package body, maintaining a distance of less than 300 μm from the sensing region, and incorporating a redistribution layer and light permeable member to prevent contamination, while ensuring bonding strength through a specific packaging method.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a light permeable member is fixed onto a sensor chip through adhesive, then the light permeable member is securely attached, but the adhesive may contaminate the sensing region and cause production failures
Solution Approach 1:
The patent divides the bonding structure into multiple components: a first bonding structure attaches the light permeable member to the package body, while a second bonding structure attaches the package body to the sensor chip. This segmentation prevents adhesive from directly contacting the sensing region, eliminating contamination while maintaining bonding strength.
Solution Approach 2:
The package body serves as an intermediary component between the light permeable member and the sensor chip. By introducing this intermediate structure, the adhesive is contained within the package body assembly and prevented from reaching the sensing region, thus solving the contamination problem while preserving secure attachment.
2Volume of moving object
If the ring-shaped support is positioned close to the sensing region (less than 300 μm), then the package structure is compact, but the support may contaminate the sensing region
Solution Approach 1:
The ring-shaped support is designed with specific local properties: it is positioned at a controlled distance (less than 300 μm) from the sensing region to maintain compactness, while its ring configuration and positioning ensure it does not contact or contaminate the sensing region. The support structure has different functional zones - close enough for compactness but strategically positioned to avoid contamination.
3Strength
If adhesive is used to fix the light permeable member, then bonding is achieved, but production yield rate decreases due to contamination
Solution Approach 1:
By segmenting the bonding process into two separate bonding structures, the patent eliminates the risk of adhesive contamination to the sensing region. This segmentation ensures that adhesive is applied only in controlled locations that do not contact the sensing region, thereby maintaining bonding strength while improving production yield rate by preventing product failures.
Data Source
AI summary
A chip-scale sensor package structure includes a sensor chip, a first package body surrounding and connected to an outer lateral side of the sensor chip, a ring-shaped support disposed on a top side of the first package body, a light permeable member disposed on the ring-shaped support, and a redistribution layer (RDL) disposed on a bottom surface of the sensor chip and a bottom side of the first package body. The sensor chip includes a sensing region arranged on the top surface thereof, a plurality of internal contacts, and a plurality of conductive paths respectively connected to the internal contacts and electrically coupled to the sensing region. The sensing region is spaced apart from the ring-shaped support by a distance less than 300 μm. A bottom surface of the RDL has a plurality of external contacts electrically coupled to the internal contacts.