Sensor Package Structure With Wire-Supported Light-Permeable Sheet
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Solution Overview
Problem
Conventional sensor package structures face issues where the light-permeable sheet presses against metal wires, causing deformation and affecting signal transmission due to excessive weight or tilting.
Innovation Solution
A sensor package structure design featuring a substrate, sensor chip, first and second metal wires, a ring-shaped supporting layer, and a light-permeable sheet, where the second metal wires are structured to support the light-permeable sheet without signal transmission function, preventing compression of first metal wires by arranging them higher than first metal wires and using a supporting layer to maintain signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the light-permeable sheet is made heavier or larger to improve structural stability, then the supporting strength increases, but the sheet presses against metal wires causing deformation and signal transmission issues
Solution Approach 1:
The patent divides the supporting function into two separate components: the ring-shaped supporting layer provides structural stability, while the second metal wires (ground wires) provide additional support without carrying signals. This segmentation allows the light-permeable sheet to be supported without pressing against the signal-transmitting first metal wires, thus resolving the contradiction between structural stability and signal transmission reliability.
Solution Approach 2:
The second metal wires (ground wires) are designed to serve multiple functions: they provide structural support for the light-permeable sheet and simultaneously serve as ground connections. This multi-functionality allows the sheet to be supported without compromising signal transmission, as the ground wires bear the supporting load while the first metal wires remain free for signal transmission.
2Area of stationary object
If the light-permeable sheet is tilted or has excessive weight, then it provides better coverage, but it presses against metal wires causing deformation
Solution Approach 1:
The supporting function is segmented between the ring-shaped supporting layer and the second metal wires, which together bear the weight and prevent tilting of the light-permeable sheet. This segmentation ensures that the first metal wires are not subjected to mechanical stress from the sheet, thus preventing deformation while maintaining adequate sheet coverage.
Solution Approach 2:
The second metal wires (ground wires) act as intermediaries that absorb the mechanical load from the light-permeable sheet. By introducing these intermediary support elements, the sheet can maintain proper coverage without directly pressing against the first metal wires, thus preventing wire deformation while ensuring adequate coverage.
3Strength
If additional metal wires are added to support the light-permeable sheet, then the supporting strength increases, but the device complexity increases
Solution Approach 1:
The second metal wires are designed to serve dual purposes: providing structural support for the light-permeable sheet and functioning as ground connections. This multi-functionality increases supporting strength without proportionally increasing device complexity, as the same wires perform both support and electrical grounding functions.
Solution Approach 2:
The patent merges the supporting function with the grounding function by using the second metal wires for both purposes. This merging reduces the need for separate support structures, thereby increasing supporting strength while minimizing the increase in device complexity.
Data Source
AI summary
A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of first metal wires, a plurality of second metal wires, a ring-shaped supporting layer formed on the sensor chip, and a light-permeable sheet. The first metal wires and the second metal wires are connected to the substrate and the sensor chip. Each edge of a top surface of the sensor chip is provided with at least one of the second metal wires adjacent thereto. Each of the second metal wires has a highest endpoint that is higher than a highest endpoint of any one of the first metal wires with respect to the substrate, and the light-permeable sheet is disposed on the ring-shaped supporting layer and abuts against the highest endpoints of the second metal wires, such that the first metal wires are not in contact with the light-permeable sheet.