Sensor Package Array With Segmented Plastic Shield
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Solution Overview
Problem
Current methods for reducing the size of optical sensor package structures lead to high signal crosstalk, requiring additional algorithm methods that increase manufacturing costs and may not accurately rectify sensing deviations.
Innovation Solution
A manufacturing method involving a plastic shield with barrier walls positioned between emitters and detectors on a substrate, along with filling sealing material in the grooves formed between the shield and substrate to reduce package volume and prevent signal crosstalk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of stationary object
If the size of optical sensor package structures is reduced through utilizing particular sealing material or not using light shielding elements, then the volume of package structures is reduced, but signal crosstalk increases
Solution Approach 1:
The plastic shield is segmented into multiple barrier walls that are disposed between adjacent sensors. Each barrier wall independently blocks light between specific sensor pairs, allowing the package to be compact while preventing crosstalk through localized segmentation rather than a single large shielding structure
Solution Approach 2:
Barrier walls made of light-blocking material are introduced as intermediary elements between the emitters and detectors of adjacent sensors. These barrier walls act as mediators that selectively block stray light while allowing the package structure to maintain reduced volume without requiring extensive spacing between sensors
2Measurement precision
If algorithm methods are added in chips to rectify high signal crosstalk, then sensing deviation caused by crosstalk is compensated, but manufacturing cost increases
Solution Approach 1:
The invention converts the harmful effect of light traveling between sensors into a beneficial solution by using barrier walls to block stray light paths. This physical prevention of crosstalk eliminates the need for complex algorithmic compensation methods, reducing manufacturing cost while maintaining or improving sensing accuracy
Solution Approach 2:
The harmful light paths are extracted and blocked by removing the ability of light to travel between adjacent sensors through the introduction of barrier walls. This extracts the crosstalk problem from the system physically rather than attempting to correct it through additional algorithmic processing in the chip
3Object-generated harmful factors
If barrier walls are disposed between emitters and detectors, then signal crosstalk is blocked, but device complexity increases
Solution Approach 1:
Multiple barrier walls are merged into a single integrated plastic shield component that is disposed over the substrate. This combining of multiple light-blocking elements into one unified structure prevents crosstalk while minimizing the increase in device complexity, as the shield can be implemented as a single molding or fabrication step
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces the volume of sensor package structures while enhancing sensitivity without increasing costs, by blocking direct light transmission between emitters and detectors, thus minimizing signal crosstalk interference.
Implementation Method 1
the plurality of barrier walls are respectively positioned between each of the plurality of emitters and each of the plurality of detectors, so as to block and prevent the light emitted by each of the plurality of emitters from being transmitted to each of the corresponding plurality of detectors
Data Source
AI summary
A sensor package array, a method of manufacturing the same, and a sensor package structure are provided. The method of manufacturing a sensor package array including: disposing a plurality of sensors on a substrate sequentially in an array; electrically connecting the plurality of sensors to the substrate; disposing a plastic shield on the substrate, so as to form a plurality of channels and a plurality of accommodating grooves among the plastic shield, the substrate, and the plurality of sensors; and filling a sealing material in the plurality of accommodating grooves, through the plurality of channels.