Sensor Package Spacer Elevates Die to Reduce Flow Turbulence
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Solution Overview
Problem
Existing sensor packages face challenges in efficiently detecting properties of substances due to turbulence and flow interference caused by the sensor die's proximity to channel surfaces, which affects the accuracy and functionality of the sensing elements.
Innovation Solution
The sensor package design includes a housing with a flow channel and an electrically conductive spacer that elevates the sensor die within the channel, reducing turbulence by positioning it centrally and using an embedded lead frame for electrical connection, allowing for improved detection of substance properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the sensor die is positioned close to the channel surface, then the device complexity is reduced, but turbulence and flow interference increase affecting detection accuracy
Solution Approach 1:
The sensor die is elevated from the bottom surface into the three-dimensional space of the flow channel, transitioning from a two-dimensional surface mounting to a three-dimensional positioning. This vertical dimensionality change allows the sensor to be positioned centrally in the flow path, reducing turbulence interference while maintaining structural simplicity through the spacer mechanism.
Solution Approach 2:
An electrically conductive spacer is introduced as an intermediary component between the housing substrate and the sensor die. This spacer serves multiple functions: it provides mechanical support for elevation, establishes electrical connection through its conductive properties, and simplifies the overall structure by integrating mounting and connectivity functions into a single element.
2Measurement precision
If the sensor die is elevated centrally in the flow channel, then turbulence is reduced improving detection accuracy, but device complexity increases due to additional spacer components
Solution Approach 1:
The electrically conductive spacer is designed to perform multiple functions simultaneously: it provides mechanical elevation support, establishes electrical connection between the sensor die and substrate, and positions the sensor centrally in the flow channel. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity while achieving turbulence reduction and improved detection accuracy.
3Reliability
If a metal slug spacer is used for electrical connection, then electrical conductivity is improved, but manufacturing precision requirements increase
Solution Approach 1:
The spacer material's electrical conductivity parameter is changed from non-conductive to conductive by using metal slug or embedded lead frame materials. This parameter change ensures reliable electrical connection between the sensor die and substrate, while the manufacturing precision challenges are managed through design tolerances and assembly processes specific to conductive materials.
Data Source
AI summary
A sensor package is disclosed. The sensor package can include a housing that at least partially defines a flow channel. The sensor package can also include an electrically conductive spacer that is disposed on a surface of the housing in the flow channel. The sensor package can further include a sensor die that is disposed in and exposed to the flow channel. The sensor die electrically attached to the spacer such that the sensor die is elevated relative to the surface of the housing.