Sensor Package Heat-Dissipation Substrate With Insulated Thermal Vias
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Solution Overview
Problem
The semiconductor industry faces challenges in heat dissipation for compact integrated fan-out packages, where existing solutions struggle to efficiently manage thermal conductivity and rigidity while maintaining electrical insulation.
Innovation Solution
A semiconductor package design incorporating a heat dissipation substrate with high thermal conductivity, conductive through-vias, and redistribution structures, along with an insulating encapsulant, to enhance heat dissipation and electrical connectivity, utilizing materials like aluminum nitride and copper for effective thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the package size is reduced to achieve compactness, then the area occupied by the package is reduced, but the heat dissipation capability deteriorates
Solution Approach 1:
The patent employs a composite substrate structure combining metal layers (copper, aluminum) with dielectric materials (epoxy, glass fibers) to achieve both compact dimensions and effective heat dissipation. The metal layers provide high thermal conductivity pathways while the dielectric materials provide electrical insulation, resolving the contradiction between small package size and heat dissipation capability.
Solution Approach 2:
The patent introduces thermal vias and heat dissipation structures as intermediary elements between the semiconductor die and the external environment. These intermediaries conduct heat away from the compact package interior to external heat sinks, enabling effective thermal management despite the reduced package area.
2Temperature
If conductive materials are added to improve heat dissipation, then thermal conductivity is improved, but electrical insulation capability deteriorates
Solution Approach 1:
The patent applies different material properties to different regions: copper layers and thermal vias are used in heat-generating regions for high thermal conductivity, while dielectric materials and insulation layers are used in regions requiring electrical isolation. This spatial differentiation of material properties allows simultaneous achievement of heat dissipation and electrical insulation.
Solution Approach 2:
The substrate is constructed as a composite structure with alternating conductive metal layers and insulating dielectric layers. This composite architecture provides thermal conduction pathways through the metal layers while maintaining electrical insulation through the dielectric barriers, resolving the contradiction between thermal and electrical properties.
3Length of stationary object
If the substrate thickness is reduced to achieve thinner packages, then the package thickness is reduced, but the rigidity and structural stability deteriorate
Solution Approach 1:
The patent uses composite substrate construction with multiple thin layers of dielectric materials reinforced with glass fibers, combined with metal support layers. This layered composite structure achieves the required rigidity and structural stability even at reduced overall thickness, as each layer contributes to the mechanical strength while maintaining a thin profile.
Solution Approach 2:
The patent employs thin film dielectric layers with embedded conductive patterns that provide both mechanical support and electrical functionality. These thin films are engineered to maintain structural integrity and rigidity despite their reduced thickness, enabling thin package design without sacrificing mechanical strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves heat dissipation efficiency, maintains electrical insulation, and reduces package thickness, ensuring the sensor die is kept at a suitable operation temperature, thereby addressing the thermal management challenges in compact semiconductor packages.
Implementation Method 1
heat dissipation substrate with high thermal conductivity
Implementation Method 2
insulating encapsulant
Data Source
AI summary
A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure. A method of forming the semiconductor package is also provided.