Sensor Packaging Sealing Layer Moisture Ingress Prevention
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Solution Overview
Problem
Existing sensor packaging structures fail to effectively prevent moisture from leaking through the package, which can interfere with the operation of sensors in certain applications.
Innovation Solution
A sensor packaging structure that includes a sensor die, a bonding material, and a transparent material, where a sealing material with one or more layers, potentially including a metal layer and a passivation layer, is applied to the interfaces between the sensor die and the bonding material, and between the bonding material and the transparent material at the edge portions to prevent moisture ingress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sensor is packaged with a bonding material to couple the sensor die to the transparent material, then the sensor is protected and structurally supported, but moisture can still leak through the package and interfere with sensor operations
Solution Approach 1:
The sealing material is divided into multiple layers (first sealing layer and second sealing layer) that are applied to different interfaces. The first sealing layer seals the interface between the sensor die and bonding material, while the second sealing layer seals the interface between the bonding material and transparent material. This segmented approach addresses moisture ingress at each specific interface separately, ensuring comprehensive protection while maintaining structural integrity.
Solution Approach 2:
The sealing material acts as an intermediary substance between the sensor die/bonding material and the external environment. This sealing material includes a first sealing layer disposed on the interface between the sensor die and bonding material, and a second sealing layer disposed on the interface between the bonding material and transparent material, creating a protective barrier that prevents moisture ingress while allowing the bonding material to perform its coupling function.
2Object-affected harmful factors
If sealing material is applied to the interfaces to prevent moisture ingress, then moisture protection is improved, but the device structure becomes more complex
Solution Approach 1:
The sealing function is merged with the existing packaging structure by applying sealing layers directly to the interfaces between components. The first sealing layer is integrated with the sensor die and bonding material interface, and the second sealing layer is integrated with the bonding material and transparent material interface. This merging approach provides moisture protection without requiring separate sealing components, thus minimizing structural complexity.
Solution Approach 2:
The sealing material is applied as thin film layers on the interfaces between components. This first sealing layer and second sealing layer provide effective moisture barriers while maintaining the compact and simple structure of the original packaging, avoiding the need for bulky sealing mechanisms.
Data Source
AI summary
According to an aspect, a sensor packaging structure includes a sensor die having a first surface and a second surface opposite the first surface, where the sensor die defines a sensor edge disposed between the first surface and the second surface. The sensor packaging structure includes a bonding material having a first surface and a second surface opposite the second surface, where the bonding material defines a bonding material edge disposed between the first surface of the bonding material and the second surface of the bonding material. The sensor packaging structure includes a transparent material, where the bonding material couples the sensor die to the transparent material. The sealing material is disposed on an interface between the sensor die and the bonding material, and at least one of a portion of the sensor edge or a portion of the bonding material edge.