Sensor Pad Exposure via Releasing Pattern Lithography
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Solution Overview
Problem
The existing methods for fabricating sensor devices are inefficient in removing optical films from the pad region, which hinders the bonding of external devices and affects fabrication efficiency.
Innovation Solution
A method involving the formation of a releasing pattern on the pad region, followed by a lens material layer, where the releasing pattern is removed through a lithography process to expose the pad, allowing for efficient planarization and simplification of the fabrication process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the optical film is removed from the pad region using conventional methods, then the pad can be exposed for bonding, but the fabrication process becomes complex and time-consuming
Solution Approach 1:
The method performs preliminary actions by forming the releasing pattern and lens material layer structure before final pad exposure is needed. The releasing pattern is created in advance during the optical film formation stage, and the lens material is deposited to cover both the optical film and pad region, preparing the structure for subsequent simple removal steps that expose the pad without requiring complex separate removal processes.
Solution Approach 2:
The method merges multiple functions into unified process steps. The lens material layer serves dual purposes: forming the optical lens on the optical film stack and providing a removal template for exposing the pad. The releasing pattern removal step simultaneously achieves both lens formation and pad exposure, combining what would traditionally be separate operations into a single integrated process.
2Ease of operation
If the optical film is removed from the pad region, then the pad is exposed for external device bonding, but the fabrication efficiency decreases
Solution Approach 1:
The releasing pattern is formed in advance during the optical film deposition phase, and the lens material layer is deposited to cover the entire structure before pad exposure is required. This preliminary preparation allows the pad to be exposed through a simple removal step rather than requiring complex sequential removal operations, thereby maintaining high fabrication efficiency.
Solution Approach 2:
The lens material layer serves multiple functions simultaneously: it forms the optical lens structure on the optical film stack, provides a sacrificial removal template for pad exposure, and defines the boundary between the optical region and pad region. This multi-functionality eliminates the need for separate dedicated steps for each purpose, improving overall fabrication efficiency.
3Ease of manufacture
If a releasing pattern is formed and lens material layer is deposited to expose the pad, then the fabrication process is simplified, but additional process steps are introduced
Solution Approach 1:
The method combines multiple objectives into integrated process steps. The lens material layer deposition and subsequent removal step simultaneously achieve lens formation, pad exposure, and optical film release. By merging these functions into unified steps rather than executing them as separate sequential operations, the actual manufacturing complexity is reduced despite the apparent addition of process steps.
Solution Approach 2:
The lens material layer performs multiple functions: serving as the optical lens, providing a sacrificial template for pad exposure, and defining region boundaries. This multi-functionality allows a single material layer to accomplish what would traditionally require multiple separate layers and processes, thereby simplifying the overall manufacturing approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively exposes the pad region, enabling efficient bonding with external devices and improving the overall fabrication efficiency of sensor devices by simplifying the removal of optical films.
Implementation Method 1
patterning the photoresist material layer using a lithography process to form the releasing pattern and a photoresist pattern on the releasing pattern
Data Source
AI summary
A method of fabricating a sensor device including at least the following steps is provided. An optical film stack is formed on a sensor substrate, wherein the sensor substrate includes a sensor region and a pad region beside the sensor region, and the optical film stack covers the sensor region while exposes the pad region. A releasing pattern is formed on the pad region. A lens material layer is formed on the sensor substrate to cover the releasing pattern and the optical film stack. The releasing pattern is removed from the sensor substrate to expose the pad region by patterning the lens material layer to form a lens on the optical film stack.