Integrated Sensor Substrate for Precise Surface Distance Sensing
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Solution Overview
Problem
Existing semiconductor manufacturing processes face challenges in accurately measuring distances to target surfaces due to mechanical tolerances and limited space for sensors, which affects the detection and identification of micro and nano-scale defects.
Innovation Solution
A sensor substrate with integrated distance sensors and charged particle optical components is used to generate measurement signals representative of distances to target surfaces, enabling precise positioning and defect detection in semiconductor manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If separate distance sensors and charged particle optical components are used, then mechanical tolerances between components and sensors can be accommodated, but the available space for sensors is limited and measurement accuracy is reduced
Solution Approach 1:
The patent combines distance sensors and charged particle optical components into a single integrated sensor substrate. This merging eliminates the need for separate mounting of these components, thereby saving space while maintaining accurate distance measurement capabilities. The integration ensures that the distance sensor and optical components share a common reference frame, improving measurement precision without requiring additional space.
Solution Approach 2:
The sensor substrate serves multiple functions: it houses both the distance sensor for measuring distances to the sample surface and the charged particle optical components for detecting sample characteristics. This multi-functionality allows the same substrate to perform both distance measurement and sample analysis, optimizing space utilization while maintaining measurement accuracy.
2Measurement precision
If multiple separate sensors are used to detect component locations, then accurate position detection is achieved, but the device complexity and calibration requirements increase
Solution Approach 1:
The patent merges multiple sensing functions into a single integrated sensor substrate that contains both distance sensors and charged particle optical components. This integration reduces device complexity by eliminating the need for separate sensor assemblies and their associated mounting mechanisms. The unified substrate provides a common reference frame, simplifying calibration while maintaining high position detection accuracy.
3Ease of manufacture
If mechanical tolerances between components and sensors are relaxed, then ease of assembly is improved, but the accuracy of distance measurements and defect detection is reduced
Solution Approach 1:
The integration of distance sensors and charged particle optical components on a single substrate eliminates the need for precise mechanical assembly between separate components. The unified structure inherently maintains accurate relative positioning, achieving high defect detection accuracy while simplifying the assembly process. This approach relaxes mechanical tolerance requirements while preserving manufacturing precision.
Data Source
AI summary
The embodiments of the present disclosure provide a sensor substrate for a charged particle optical device and/or a charged particle assessment apparatus, the sensor substrate comprising: at least one distance sensor configured to generate a measurement signal representative of a distance between the distance sensor and a facing surface of a target; and at least one charged particle optical component.