Sensor Test Apparatus With Multi-Physical Application Unit
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Solution Overview
Problem
Existing test systems for packaged integrated circuits cannot effectively test sensors as they require applying physical quantities that the sensor is designed to detect, and do not account for the packaging method of the integrated circuit.
Innovation Solution
A sensor test apparatus that includes an application unit with multiple devices to apply different physical quantities to the sensor, a test unit to evaluate the sensor, and a conveying device to move the sensor through the application unit, allowing for efficient testing by applying various conditions such as temperature, pressure, and magnetic fields.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional test system for packaged integrated circuits is used, then the testing process is simple, but it cannot effectively test sensors because it cannot apply the physical quantities that sensors are designed to detect
Solution Approach 1:
The test system is designed to handle both packaged integrated circuits and sensors with the same basic structure (socket and conveying device). The application unit is configured to apply different physical quantities (temperature, pressure, magnetic fields) depending on the test object, making the system universal and capable of testing both ICs and sensors without requiring complete redesign.
Solution Approach 2:
The system changes the physical parameters applied to the test object based on what is being tested. For sensors, the application unit applies specific physical quantities (temperature, pressure, magnetic fields) that correspond to the sensor type. For packaged ICs, conventional electrical testing parameters are used. This parameter adaptability enables reliable sensor testing while maintaining compatibility with existing IC testing procedures.
2Measurement precision
If multiple physical quantities are applied to the sensor to improve testing accuracy, then the measurement precision improves, but the device complexity increases due to multiple application parts
Solution Approach 1:
A single application unit is designed to perform multiple functions by applying different physical quantities (temperature via heating/cooling means, pressure via pressure application means, magnetic fields via magnetic field application means). This multi-functional design enables comprehensive sensor testing without requiring separate dedicated devices for each physical quantity, thus improving measurement precision while controlling device complexity.
Solution Approach 2:
Multiple application mechanisms (heating/cooling means, pressure application means, magnetic field application means) are merged into one integrated application unit that operates around a central socket. This consolidation allows the system to apply multiple physical quantities to the sensor simultaneously or sequentially without the complexity of multiple separate testing stations, improving both measurement precision and operational efficiency.
3Productivity
If the sensor is manually handled and positioned for testing, then the ease of operation is high, but the productivity is low due to time-consuming manual processes
Solution Approach 1:
The conveying device automatically handles the sensor throughout the entire testing process. The sensor is conveyed into the application unit, positioned at the socket, and removed automatically without manual intervention. This self-service automation eliminates time-consuming manual handling while maintaining operational simplicity, significantly improving testing throughput and productivity.
Solution Approach 2:
An automated conveying device acts as an intermediary between the sensor and the testing apparatus. This mediator automatically performs the tasks of picking up the sensor, conveying it to the application unit, positioning it at the socket, and removing it after testing. This intermediary automation eliminates the need for manual operation while keeping the system easy to control, thereby improving productivity without sacrificing ease of operation.
4Reliability
If thermal stress is applied to the sensor during testing, then the reliability of sensor performance under temperature variation is improved, but the sensor requires preheating and heat removal which increases testing time
Solution Approach 1:
The preheat part is positioned in the conveying path before the application unit and applies thermal stress to the sensor before it reaches the testing position. This preliminary thermal action ensures the sensor is at the required temperature before testing begins, improving temperature stability and reliability. The heat removal part similarly acts after testing to quickly cool the sensor, minimizing the time the sensor spends at elevated temperatures and reducing overall thermal adjustment time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient testing of sensors by applying relevant physical quantities and conveying the sensor through the test system, improving the accuracy and efficiency of sensor evaluation.
Implementation Method 1
a second application part which applies a second physical quantity to the sensor, the second physical quantity being different from the first physical quantity; wherein the second application part is a temperature adjustment part which applies a thermal stress to the sensor to adjust the temperature of the sensor
Implementation Method 2
the first application part is a pressure application part which applies a pressure to the sensor
Implementation Method 3
the first application part is a magnetic field application part which applies a magnetic field to the sensor
Data Source
AI summary
A sensor test apparatus capable of efficiently testing a sensor is provided.A sensor test apparatus 30 which tests the pressure sensor 90 includes an application unit 40 including an application device 42 including a socket 445 to which the sensor 90 is electronically connected, a pressure chamber 43 which applies pressure to the sensor 90, and a heat sink 443,462 which applies a thermal stress to the sensor 90, the test unit 35 which tests the sensor 90 via the socket 445, and the conveying robot 33 which conveys the sensor 90 into and out of the application unit 40.