Configurable Serial Memory Interface for High-Bandwidth Module Cascades
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Solution Overview
Problem
Conventional memory interfaces are inadequate for high-bandwidth, low-latency data transfer required by artificial intelligence and Big Data applications, particularly in systems with limited host resources and high memory density needs.
Innovation Solution
A memory interface system utilizing configurable high-speed serial data lanes to connect multiple memory modules in a cascaded or star configuration, eliminating the need for bridge controllers and minimizing latency and power consumption, while maintaining full-bandwidth access to all memory locations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional memory interfaces are used to connect memory modules to host processor, then the system structure is simple, but the data transfer bandwidth is insufficient and latency is high for AI and Big Data applications
Solution Approach 1:
The patent segments the memory system into multiple independent memory modules, each with its own interface to the host processor. This allows parallel data transfer operations across multiple modules simultaneously, increasing overall bandwidth while maintaining low latency through direct host access to each module.
Solution Approach 2:
The patent transitions from a single-dimension memory architecture to a multi-dimensional stacked configuration where memory modules are arranged in three-dimensional space. This spatial reorganization enables multiple high-speed serial data lanes to operate in parallel, dramatically increasing data transfer bandwidth without proportionally increasing latency.
2Quantity of substance
If multiple memory modules are connected through bridge controllers, then memory density is increased, but device complexity and power consumption increase
Solution Approach 1:
The patent extracts and eliminates the bridge controller component from the memory system. Instead of using intermediate bridge controllers to connect memory modules to the host, each memory module is equipped with direct interface capabilities, simplifying the overall system architecture while maintaining high memory density.
Solution Approach 2:
Each memory module is designed to be self-sufficient with integrated transceivers and interface logic, eliminating the need for external bridge controllers. This self-service approach reduces device complexity and removes unnecessary intermediary components while preserving memory expansion capabilities.
3Quantity of substance
If multiple memory modules are connected through bridge controllers, then memory density is increased, but power consumption increases
Solution Approach 1:
The patent removes the power-hungry bridge controller components from the system architecture. By eliminating these intermediate controllers and their associated power management circuits, overall system power consumption is reduced while memory density is maintained through direct module-to-host connections.
Solution Approach 2:
The patent implements partial connectivity where not all memory modules need to be actively connected to the host simultaneously. The system can dynamically activate only the necessary number of data lanes and transceivers based on current bandwidth requirements, reducing power consumption during low-activity periods while maintaining the capability for high-density memory operations when needed.
4Productivity
If configurable high-speed serial data lanes are implemented, then data transfer bandwidth is increased, but device complexity increases
Solution Approach 1:
The patent implements universal transceiver modules that can dynamically configure their data lanes for multiple functions: direct host communication, inter-module communication, or hybrid modes. This multi-functionality allows the same hardware infrastructure to support various bandwidth requirements without increasing device complexity, as the transceivers adapt their configuration based on operational needs rather than requiring dedicated circuits for each scenario.
Data Source
AI summary
A memory module including a memory array of storage transistors and a control circuit where the control circuit includes a memory interface for providing high bandwidth access to the memory array on serial data lanes. In some embodiments, the control circuit of a memory module includes multiple transceivers for connecting to serial data lanes. In one embodiment, the memory interface of a memory module configures some transceivers for host connection or for upstream connection to an upstream memory module and configures other transceivers for downstream connection to a downstream memory module. In other embodiments, a multi-module memory device is formed using multiple memory modules connected in a cascade configuration or in a star configuration to provide high bandwidth memory access to all memory locations of the multiple memory modules using the given number of serial data lanes of the host connection.