Serial Power Coupling in Semiconductor Blocks for Smaller SiP Packages
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Solution Overview
Problem
Semiconductor devices face challenges in reducing power consumption and minimizing package size while maintaining functionality, particularly in System-in-Package (SiP) designs, where conventional designs often require multiple external components and result in higher power consumption and larger form factors.
Innovation Solution
The implementation of a serial power system within semiconductor devices, where functional blocks such as semiconductor dies or chips are coupled in series between power and ground nodes, allowing a predetermined current to flow through them, reducing power consumption and enabling a smaller package size by eliminating the need for additional external components and optimizing Bill of Materials (BOM) and circuit area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If conventional SiP designs are used with multiple external components, then functional capabilities are maintained, but power consumption increases and package size increases
Solution Approach 1:
The patent combines multiple functional blocks (first functional block and second functional block) into a single integrated structure where the output of one directly connects to the input of the other within the same package. This merging eliminates the need for separate external components and interconnections, thereby reducing power consumption and simplifying the device while maintaining full functionality.
2Area of stationary object
If conventional SiP designs are used with multiple external components, then functional capabilities are maintained, but package size increases
Solution Approach 1:
The patent integrates multiple functional blocks and their interconnections within a single package structure, eliminating the need for separate external components. This consolidation directly reduces the overall package size while maintaining all necessary functional capabilities through internal integration.
3Use of energy by moving object
If functional blocks are coupled in serial with predetermined current flow, then power consumption is reduced, but device complexity changes
Solution Approach 1:
The patent divides the device into distinct functional blocks (first functional block and second functional block) that are coupled in serial configuration. Each block operates with a predetermined current flow, allowing for optimized power consumption in each segment while maintaining overall system functionality through the segmented architecture.
Data Source
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AI summary
A semiconductor device includes a plurality of functional blocks (110, 120), each being configured to provide at least one predetermined function. The functional blocks at least include a first functional block (110) and a second functional block (120) . The first functional block and the second functional block are coupled in serial with a predetermined current (I) flowing therethrough.