Series-Connected LED Die Structure for Heat Dissipation
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Solution Overview
Problem
Conventional LEDs face heat dissipation issues due to leakage current and inefficient heat transfer, leading to reduced luminous efficiency, accelerated aging, and altered optical properties, while their application flexibility is limited by large voltage conversion circuits.
Innovation Solution
A light emitting diode with a serially connected structure formed by coupling p-type and n-type semi-conductive layers of neighboring LED dies, reducing consuming current and heat generation, and allowing for enhanced illumination and smaller heat dissipating devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional LED structure with single die is used, then manufacturing is simple, but heat dissipation is insufficient and leakage current is high
Solution Approach 1:
The invention divides a single LED die into multiple LED dies (first LED die and second LED die) connected in series. Each die has its own active region with quantum well structures. This segmentation reduces leakage current in each individual die and improves heat dissipation by distributing heat generation across multiple smaller dies, resolving the contradiction between heat dissipation efficiency and structural complexity.
Solution Approach 2:
The invention combines multiple LED dies in series connection within a single LED device package. The series connection merges the light output of multiple dies while reducing the current through each die, which reduces leakage current and heat generation per die. This merging approach improves overall heat dissipation efficiency while maintaining a compact device structure.
2Illumination intensity
If high current is used to increase illumination, then light output increases, but heat generation increases and reduces reliability
Solution Approach 1:
By segmenting the LED into multiple dies connected in series, the total voltage is distributed across each die while the current through each die is reduced. This segmentation allows achieving high illumination intensity through combined light output of multiple dies without subjecting any single die to high current stress, thereby improving reliability.
Solution Approach 2:
The invention changes the electrical parameters by using series connection configuration, which increases the operating voltage but reduces the operating current compared to a single die configuration. This parameter change (from high current to low current operation) reduces heat generation and leakage current while maintaining or enhancing light output through combined emission from multiple dies, thus improving reliability.
3Adaptability or versatility
If voltage conversion circuit is included in driver, then LED can be excited from 110V, but driver size increases and application flexibility is reduced
Solution Approach 1:
The series connection of multiple LED dies changes the electrical parameters of the LED device, increasing its forward voltage requirement. This parameter change allows the LED to be directly compatible with higher voltage sources (such as 110V AC after simple rectification) without requiring large voltage conversion circuits in the driver, thereby reducing driver size and improving application flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes leakage current, reduces the size of heat dissipating devices, and enhances illumination, while enabling smaller and more flexible driving circuits, thus improving the LED's reliability and application flexibility.
Implementation Method 1
When a conventional LED is excited by the flow of current, generally the temperatures of components in the LED can be raised to above normal due to leakage current effect inside the semiconductor die of the LED
Implementation Method 2
the consuming current and heat generation of the light emitting diode are lowered so that the size of heat dissipating device for the light emitting diode can be reduced
Data Source
AI summary
The present invention provides a light emitting diode, which comprises a first LED die and a second LED die, each die comprising a first semi-conductive layer, a second semi-conductive layer, and a multiple quantum well layer disposed between the first and the second semi-conductive layers, wherein the first semi-conductive layer of the first LED die is coupled to the second semi-conductive layer of the second LED die so as to form a serially connected structure whereby the consuming current and heat generation of the light emitting diode are lowered so that the size of heat dissipating device for the light emitting diode can be reduced and illumination of the light emitting diode can be enhanced.