Serpentine Channel Cooling Plate for Semiconductor Window Noise Reduction

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Solution Overview

Problem

Conventional cooling systems for RF-transmissive windows in semiconductor processing chambers generate excessive noise and undesirable air movement due to high air flow rates, and often require facility ambient air, leading to uneven temperature distribution and increased complexity.

Innovation Solution

A cooling system using clean dry air (CDA) from a dedicated source, featuring a cooling plate with serpentine channels and a ceiling portion, which allows for zoned cooling and reduces noise by eliminating the need for air amplifiers, providing more uniform temperature distribution across the window.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If air amplifiers are used to cool the window, then cooling effectiveness is improved, but noise level increases significantly

Engineering Contradiction:
Improvewindow temperatureVSAvoidnoise
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent removes air amplifiers from the cooling system entirely, extracting the noise-generating component while maintaining cooling functionality through alternative means (direct CDA flow through channels in the window assembly).

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the mechanical air amplifier system with a simpler direct-flow cooling approach using channels formed within the window assembly itself, eliminating the need for complex mechanical noise-generating components.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Temperature

If high air flow rates are used through air amplifiers, then cooling capacity is improved, but air movement and facility disruption increase

Engineering Contradiction:
Improvewindow temperatureVSAvoidair movement
Core Design Contradiction:
TemperatureVSObject-generated harmful factors

Solution Approach 1:

The patent directs cooling flow through specific channels located at the back surface of the window assembly, concentrating cooling action where it is most needed (at the hot window surface) rather than using high-volume ambient air movement.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent uses the window assembly itself as an intermediary structure that contains internal channels to guide CDA flow directly against the window's back surface, mediating the cooling process without requiring high-velocity ambient air movement.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Temperature

If air amplifiers are used to cool the window, then cooling effectiveness is improved, but system complexity increases

Engineering Contradiction:
Improvewindow temperatureVSAvoidcooling system complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the cooling function directly into the window assembly by forming channels within the window structure itself, combining what were previously separate components (window and cooling system) into a single integrated assembly.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The window assembly serves multiple functions: it acts as both the RF-transmissive window and the cooling structure with integrated channels, eliminating the need for separate air amplifier components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Temperature

If facility ambient air is used for cooling, then cooling capacity is improved, but temperature uniformity deteriorates

Engineering Contradiction:
Improvecooling capacityVSAvoidtemperature uniformity
Core Design Contradiction:
TemperatureVSManufacturing precision

Solution Approach 1:

The patent uses controlled CDA flow through specifically designed channels at the back surface of the window to provide localized, uniform cooling across the window area, ensuring consistent temperature distribution rather than relying on chaotic ambient air flow.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system significantly reduces noise levels, achieves more uniform cooling, and is more cost-effective with fewer parts and smaller packaging, while maintaining effective cooling performance.

Implementation Method 1

The walls may define, at least in part, a plurality of serpentine channels... through which clean dry air (CDA) may be flowed... to cool the window

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 2

cooling plate having a ceiling portion... one or more sets of walls extending from the ceiling portion towards the window so as to form a plurality of serpentine channels

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20230120662A1Cooling plate for semiconductor processing chamber window
Publication Date: 2023.04.20 LAM RES CORP
  • US20230120662A1 patent drawing
  • US20230120662A1 patent drawing
  • US20230120662A1 patent drawing

AI summary

Cooling plates for radio-frequency transmissive windows in semiconductor processing chambers are disclosed. The cooling plates feature one or more sets of walls that, for each set, define a plurality of serpentine channels that are arranged in a circular array, thereby providing an annular region having serpentine channels extending therethrough. The cooling plate may be placed adjacent to the window and fluid may be flowed through it to provide cooling to the window. The cooling plates disclosed may require a much lower amount of total volumetric flow in order to achieve comparable or superior performance compared with traditional window cooling systems using air multipliers or air amplifiers.