Semiconductor Package Substrate with Serpentine Protrusions for Low Warpage
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Solution Overview
Problem
Conventional methods of manufacturing semiconductor package substrates are complicated and lack precision, particularly in forming through-holes and patterning copper foils, which complicates the manufacturing process and affects the substrate's stability.
Innovation Solution
A semiconductor package substrate design featuring a base substrate with protrusions and a resin insertion, where the protrusions are arranged in serpentine shapes and connected by a connecting portion, enhancing structural stability and insulation, and the resin is disposed within grooves and through-holes to improve manufacturing precision and reduce warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional method of forming through-holes and patterning copper foils is used, then the manufacturing process can be completed, but the manufacturing process becomes complicated and precision is low
Solution Approach 1:
The invention changes the fundamental parameter of the manufacturing approach by eliminating through-holes and copper foil layering. Instead of modifying existing parameters (hole size, plating thickness), it fundamentally changes the structural parameters to use a resin base substrate with integrated conductive patterns, thereby simplifying the manufacturing process and improving precision simultaneously
Solution Approach 2:
The invention uses composite materials by integrating conductive materials directly into the resin base substrate to form conductive patterns. This composite structure eliminates the need for separate copper foil layers and through-hole plating, simplifying the manufacturing process while improving precision
2Ease of manufacture
If the base substrate structure is simplified, then the manufacturing process is simplified, but the structural stability may be compromised
Solution Approach 1:
The invention introduces protrusions with curved surfaces on the base substrate. These curved geometric features enhance structural stability by distributing stress more effectively compared to flat surfaces, while maintaining the simplified manufacturing process of resin injection molding
Solution Approach 2:
The invention uses composite materials by integrating conductive materials directly into the resin base substrate to form conductive patterns. This composite structure eliminates the need for separate copper foil layers and through-hole plating, simplifying the manufacturing process while improving precision
Data Source
AI summary
A semiconductor package substrate includes a base substrate including a mounting area and a peripheral arca, at least one protrusion disposed between the mounting area and the peripheral area and protruding from the base substrate, and a resin inserted into a part of the base substrate and disposed around the at least one protrusion.