Severable Aligner Clip Preform for Multi-Size Die Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The packaging of semiconductor devices with varying sizes poses challenges due to the need for multiple clip designs and tooling investments, as existing clip-bonding technologies require different sizes of connection clips and tool sets for silicon and silicon carbide devices with distinct source pad sizes.
Innovation Solution
A severable clip preform that can be fabricated into primary and secondary clips of different sizes and shapes, allowing for local production of clips matching specific semiconductor die contact pads, reducing the need for multiple tool sets and supply lines by being cut from a metal sheet, such as copper or aluminum, to fit various device sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple clip designs are used for different semiconductor device sizes, then each device size can have an optimized clip design, but the device complexity and tooling investment increase
Solution Approach 1:
The clip preform is designed as a universal component that can be converted into multiple different clip configurations. A single preform design with standardized features (mounting holes, basic geometry) serves as a multi-functional base that can produce various clip sizes and types through localized modifications, eliminating the need for entirely different tooling sets for each device size.
Solution Approach 2:
The clip preform incorporates segmented or modular features that allow it to be divided or modified into different configurations. By having pre-defined segments or removable portions in the preform design, the same base component can be transformed into different clip sizes and shapes to accommodate various semiconductor device dimensions without requiring completely separate tooling for each variant.
2Adaptability or versatility
If multiple tool sets are used for different semiconductor devices, then each device type can be processed optimally, but the manufacturing cost and time increase
Solution Approach 1:
The system transitions from static, dedicated tooling for each device type to a dynamic, reconfigurable tooling approach. The clip preform's ability to be locally modified or adjusted within the same tooling system allows the packaging equipment to adapt dynamically between different device sizes and types without requiring physical tooling changes, thereby maintaining optimal processing capability while improving throughput.
Solution Approach 2:
The clip preform is designed in advance with pre-configured features, mounting holes, and geometric characteristics that anticipate multiple final clip configurations. This preliminary preparation allows the same preform to be quickly adapted to different device requirements without time-consuming tooling changes, enabling faster processing across multiple device types.
3Manufacturing precision
If different clip sizes are produced from separate tooling, then each clip size can be precisely controlled, but the manufacturing precision requirements across multiple tool sets increase
Solution Approach 1:
The clip preform incorporates local quality variations or localized features that can be selectively modified or removed to create different final clip dimensions. By having specific regions in the preform designed for potential local modification (such as variable thickness zones, pre-scored lines, or selectively removable portions), the system can achieve precise dimension control for different clip sizes while maintaining a standardized base tooling setup.
Data Source
AI summary
A clip preform includes a die contact portion and an aligner structure. An intermediate portion connects the die contact portion to a lead contact portion in the aligner structure. The die contact portion is configured to contact a semiconductor die. The aligner structure is configured to attach the lead contact portion to a lead post. The die contact portion, the intermediate portion, and the aligner structure form a structure of a primary clip for connecting the semiconductor die to the lead post. The clip preform is severable by removing parts of the die contact portion and the intermediate portion of the clip preform to form a secondary clip for connecting the semiconductor die to the lead post. The aligner structure, a remaining part of the die contact portion, and a remaining part of the intermediate portion of the clip preform form a structure of the secondary clip.